Effect of Bi on the microstructure and mechanical properties of Sn-Zn alloys processed by rolling

Liu, Guangyu; Ji, Shouxun

doi:10.1016/j.matchar.2018.01.017

Cited by 22 publications

(4 citation statements)

References 35 publications

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“…Subjecting to the WEEE and RoHS directives, Pb-containing solders have been removed from electronic equipment since they are poisonous and hazardous to the environment and human health [1][2][3]. As a result, the selection of unleaded solders has become a crucial area of study inspiring researchers all over the world to find and create a novel class of lead-free alloys, including Sn-Sb, Sn-Zn, Sn-Bi, Sn-Ag, Sn-Zn-Bi, Sn-Ni-Mn, Sn-Ag-Cu and Sn-Sb-Cu [4][5][6][7][8][9][10][11][12]. Over the past few years, Sn-5 wt% Sb solder alloy has drawn attention because of its excellent properties if compared with other modernistic lead-free solders [13,14].…”

Section: Introductionmentioning

confidence: 99%

Correlation of microstructure with thermal and tensile creep properties of novel Sn-5Sb-0.5Cu alloy reinforced with Co particles for soldering applications

Mousa,

Sobhy,

Mahmoud

2024

Phys. Scr.

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The present research examined how cobalt microalloying additions of 0.25, 0.5, 0.75, and 1 weight percent affected the microstructural properties, thermal features, and tensile creep characteristics of eutectic Sn-5 wt.% Sb- 0.5 wt.% Cu (SSC) lead-free solder alloy. According to the results, cobalt additions of 0.25, 0.5, and 0.75 wt.% did not affect SbSn phase but significantly refined β-Sn grains, facilitating the formation of fine fibers (Cu,Co)6Sn5 together with plate-like CoSn3 phases, and preventing the formation of Cu6Sn5 phases. Furthermore, a large amount of cobalt (1wt.%) addition accumulated in the coarsening of the CoSn3 phase. Additions of 0.25 wt.% Co, 0.75 wt.% Co, and 1wt.% Co did not affect the melting temperatures, but pasty ranges had been slightly lowered, which may enhance the thermal characteristics. Addition of 0.5 wt.% Co had unfavorable effects on both melting point and pasty range. This has significant effects on solder reliability and electronic service performance. In terms of creep behavior, the SSC-0.75 wt.% Co specimens displayed the highest creep resistance because of the fine dispersion of intermetallic compounds (IMCs) and extended the creep-rupture life to a level that is 3.0 times greater than the SSC baseline. Lower creep resistance was observed in SSC-0.25 wt.% Co specimens, which was mostly due to the smaller volume fraction of the precipitate phases and the absence of the CoSn3 phase. Depending on the determined stress exponents and activation energies, it is suggested that the dominant deformation mechanism in SSC-xCo solders is the dislocation climb controlled by short-circuit pipe diffusion across the whole temperature range that was examined.

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Section: Introductionmentioning

confidence: 99%

Correlation of microstructure with thermal and tensile creep properties of novel Sn-5Sb-0.5Cu alloy reinforced with Co particles for soldering applications

Mousa,

Sobhy,

Mahmoud

2024

Phys. Scr.

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“…Moreover, Sn–Zn eutectic solder has an unsatisfactory wettability, as zinc is rapidly oxidised in the air. It was claimed that the additions of Ni [13], Nd [14], Bi [15] and RE [16, 17] elements would improve the wetting properties of the Sn–Zn solders on Cu and Al substrates. A small amount of Ag addition could improve the oxidation resistance and mechanical properties as well [5, 18].…”

Section: Introductionmentioning

confidence: 99%

“…A small amount of Ag addition could improve the oxidation resistance and mechanical properties as well [5, 18]. Bi addition significantly refined the microstructure, and enhanced the strength and ductility of the rolled Sn-Zn solders [15]. However, few studies concern the ultrasonic-assisted soldering of Al and Cu with the optimised Sn–Zn based solder.…”

Section: Introductionmentioning

confidence: 99%

Ultrasonic-assisted soldering of aluminium and copper with Sn–Zn–Bi–Ag solder

Ren

Huang

2021

Science and Technology of Welding and Joining

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The effects of ultrasonic-assisted soldering parameters on the interfacial microstructural evolution and shear strength of designed Al/Sn-9.77Zn-11.36Bi-1.46Ag/Cu solder joints were investigated. The ultrasonic-assisted soldering process promoted the dissolution of Al substrate and roughed Al/solder interface, which improved the pinning effect of Sn-9.77Zn-11.36Bi-1.46Ag on Al substrate. With an increasing ultrasonic soldering temperature, time and power, more Al atoms dissolved from Al substrate and migrated across solder to the opposite Cu substrate to form Al-rich (Zn) solid solutions. Consequently, Al 4.2 Cu 3.2 Zn 0.7 formed between -AgZn 3 and Cu 5 Zn 8 layers at Cu substrate, resulting in thinner Cu 5 Zn 8 and higher shear strength of solder joints. The highest shear strength of solder joints (38.6 MPa) was achieved after ultrasonicassisted soldering at 300°C for 10 s under 9 W.

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“…For years, due to the environmental and human health concerns over the toxicity of lead (Pb) [1], lead-free tin (Sn)-based alloys have been extensively used as the substitutes of Pb-based alloys in the application of conventional soldering technology [2] and linear explosive products [3]. Among them, Sn-Cu alloys are particularly noticeable for packaging, solder joints, and electronic assembles due to the low cost and decent comprehensive properties [4].…”

Section: Introductionmentioning

confidence: 99%

Effect of Bi on the microstructure and mechanical properties of Sn-Zn alloys processed by rolling

Cited by 22 publications

References 35 publications

Correlation of microstructure with thermal and tensile creep properties of novel Sn-5Sb-0.5Cu alloy reinforced with Co particles for soldering applications

Correlation of microstructure with thermal and tensile creep properties of novel Sn-5Sb-0.5Cu alloy reinforced with Co particles for soldering applications

Ultrasonic-assisted soldering of aluminium and copper with Sn–Zn–Bi–Ag solder

Microstructure, dynamic restoration and recrystallization texture of Sn-Cu after rolling at room temperature

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