Novel quaternary Si-B-C-N materials are becoming increasingly attractive because of their possible high-temperature and harsh-environment applications. In the present work, amorphous Si-B-C-N films were deposited on Si and SiC substrates by reactive dc magnetron cosputtering using a single C-Si-B or B 4 C -Si target in nitrogen-argon gas mixtures. A fixed 75% Si fraction in the target erosion areas, a rf induced negative substrate bias voltage of −100 V, a substrate temperature of 350°C, and a total pressure of 0.5 Pa were used in the depositions. The corresponding discharge and deposition characteristics ͑such as the ion-to-film-forming particle flux ratio, ion energy per deposited atom, and deposition rate͒ are presented to understand complex relationships between process parameters and film characteristics. Films deposited under optimized conditions ͑B 4 C -Si target, 50% N 2 +50% Ar gas mixture͒, possessing a composition ͑in at. %͒ Si 32-34 B 9-10 C 2-4 N 49-51 with a low ͑less than 5 at. %͒ total content of hydrogen and oxygen, exhibited extremely high oxidation resistance in air at elevated temperatures ͑even above 1500°C͒. Formation of protective surface layers ͑mainly composed of Si and O͒ was proved by high-resolution transmission electron microscopy, Rutherford backscattering spectrometry, and x-ray diffraction measurements after oxidization. Amorphous structure of the Si-B-C-N films was maintained under the oxidized surface layers after annealing in air up to 1700°C ͑a limit imposed by thermogravimetric analysis in oxidative atmospheres͒.