Effect of annealing temperature and rate of sputtering on the magnetic properties and microstructure of the polycrystalline nickel films with (200) texture

Abstract

The dependences of the magnetic properties and morphology of polycrystalline nickel (Ni) films with the (200) texture that are fabricated using the dc magnetron sputtering on the SiO 2 /Si(100) substrates on sputtering rate annealing temperature T, and film thickness d are analyzed. It is demonstrated that an increase in the sputtering rate from 17 to 35 nm/min does not affect the saturation magnetization 4πM and ferromagnetic resonance line width ΔH but leads to a significant increase in the coercivity H c for the films whose thickness d is greater than critical thickness d cr (d > d cr ). It is also demonstrated that d cr depends on both sputtering rate and annealing temperature. The films with the thickness d > d cr exhibit the stripe domain structure whose period increases with increasing d and rate v. The annealing of the films with d ≥ 40 nm at T ≈ 200-400°C results in an increase in ΔH and H c by a factor of 2-4, an increase in 4πM by 25%, an increase in grain size ξ by a factor of 20-30, and the formation of the stripe domain structure in the films that do not exhibit such structure prior to annealing and substantial strengthening of the (200) texture.

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“…oxidized Si, is determined by the minimization of surface and interface energy and it is usually {111} [41]. However, it has been recently noticed that in thin Ni films one may under certain circumstances observe {200} texture [42]. This is the case when in the polycrystalline nickel films exhibit more significant internal deformations in comparison to grains with {111} texture.…”

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“…Annealing treatment.-Annealing treatment is recognized as an effective way to improve the Ni thermal resistor's performance. 28 It is performed by heating the Ni thermistor in a vacuum furnace. Annealing temperatures of 200-400°C and holding periods of 2, 4, or 6 h were considered.…”

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