Effect of aluminum concentration on the microstructure and mechanical properties of Sn–Cu–Al solder alloy

Yang, Li; Zhang, Yaocheng; Du, Chengchao; Dai, Jun; Zhang, Ning

doi:10.1016/j.microrel.2014.12.017

Cited by 25 publications

(23 citation statements)

References 19 publications

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“…It has been reported that the addition of Al in hypereutectic Sn-Cu solder alloys resulted in the remarkable refinement of primary Cu 6 Sn 5 grains since the introduction of δ-Cu 33 Al 17 or γ-Cu 9 A l4 with the significant undercooling structure before Cu 6 Sn 5 grain growth leads to the heterogeneous nucleation of Cu 6 Sn 5 [38]. Figure 2 depicts the microstructure of Sn-0.7Cu-xAl (x = 0~0.075) solder alloy [39]. The microstructures of Sn0.7Cu solder alloys are composed of β-Sn and Cu 6 Sn 5 /β-Sn eutectic composition, while the solidified Sn-0.7Cu-0.075Al alloy is composed of β-Sn, Cu 6 Sn 5 and δ-Al 2 Cu [40].…”

Section: Microstructurementioning

confidence: 99%

“…With the increase of Al concentration, the spreading coefficient of Sn-Cu-Al solder increases. Figure 20 shows the relationship between Al content and the diffusion coefficient of Sn-Cu-Al solder alloy on the Cu substrate [39]. When the Al content reaches 0.075%, the diffusion coefficient of the solder alloy increases to about 70% from the initial value of 65.23%.…”

Section: Wettabilitymentioning

confidence: 99%

“…The mechanical properties of the Sn-Cu lead-free solder alloy were improved, similar to the traditional Sn-Pb solder, by adding the trace alloying elements to the alloy. The mechanical properties of Sn-Cu solder are significantly affected by the addition of Al [39,40] showed that the microhardness of as-cast alloy increased by 6.7%, which was attributed to the refinement of grain structure and the uniform distribution of IMC in eutectic phase caused by the addition of Ge.…”

Section: Mechanical Properties and Creepmentioning

confidence: 99%

“…Spreading coefficient of Sn-0.7Cu-xAl (x = 0~0.075) lead-free solder alloys. Reproduced with permission from[39].…”

mentioning

confidence: 99%

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Structure and properties of Sn-Cu lead-free solders in electronics packaging

Zhao

Liu

Xiong

et al. 2019

Science and Technology of Advanced Materials

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With the development of lead-free solders in electronic packaging, Sn-Cu lead-free solder has attracted wide attention due to its excellent comprehensive performance and low cost. In this article, we present recent developments in Sn-Cu lead-free solder alloys. From the microstructure and interfacial structure, the evolution law of the internal structure of solder alloy/ solder joint was analysed, and the model and theory describing the formation/growth mechanism of interfacial IMC were introduced. In addition, the effects of alloying, particle strengthening and process methods on the properties of Sn-Cu lead-free solders, including wettability, melting and mechanical properties, were described. Finally, we outline the issues that need to be resolved in the future research. This figure presents the interface morphology of Sn-Cu-Ni-xPr joint. (a) x = 0, (b) x = 0.05wt%. It was clear that with the addition of 0.05% Pr, the thickness of IMC layer decreases significantly and the formation of voids at the interface is inhibited.

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Section: Microstructurementioning

confidence: 99%

Section: Wettabilitymentioning

confidence: 99%

Section: Mechanical Properties and Creepmentioning

confidence: 99%

“…Spreading coefficient of Sn-0.7Cu-xAl (x = 0~0.075) lead-free solder alloys. Reproduced with permission from[39].…”

mentioning

confidence: 99%

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Structure and properties of Sn-Cu lead-free solders in electronics packaging

Zhao

Liu

Xiong

et al. 2019

Science and Technology of Advanced Materials

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“…Yang et al [7,35] reported that the Al-modified Sn-0.7wt.%Cu alloys may exhibit lower tensile strength and higher ductility when compared with the binary Sn-0.7wt.%Cu alloy. Due to the utilization of a massive non-water-cooled mold, σ u values changing from 10 MPa to 17 MPa were obtained in the cited study [7]. In addition, the microstructures of all tested specimens were not standardized as accomplished at this point in the present investigation.…”

Section: Mechanical Properties Vs Secondary Dendrite Arm Spacingmentioning

confidence: 99%

Sn-0.5Cu(-x)Al Solder Alloys: Microstructure-Related Aspects and Tensile Properties Responses

Lima

Gouveia

Septimio

et al. 2019

Metals

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In this study, experiments were conducted to analyze the effect of 0.05 and 0.1 wt.% Al additions during the unsteady-state growth of the Sn-0.5wt.%Cu solder alloy. Various as-solidified specimens of each alloy were selected so that tensile tests could also be performed. Microstructural aspects such as the dimensions of primary, λ1, and secondary, λ2, dendritic arrays, and intermetallic compounds (IMCs) morphologies were comparatively assessed for the three tested compositions, that is, Sn-0.5wt.%Cu, Sn-0.5wt.%Cu-0.05wt.%Al, and Sn-0.5wt.%Cu-0.1wt.%Al alloys. Al addition affected neither the primary dendritic spacing nor the types of morphologies identified for the Cu6Sn5 IMC, which was found to be either globular or fibrous regardless of the alloy considered. Secondary dendrite arm spacing was found to be enlarged and the eutectic fraction was reduced with an increase in the Al-content. Tensile properties remained unaffected with the addition of Al, except for the improvement in ductility of up to 40% when compared to the Sn-0.5wt.%Cu alloy without Al trace. A smaller λ2 in size was demonstrated to be the prime microstructure parameter associated with the beneficial effect on the strength of the Sn-0.5wt.%Cu(-x)Al alloys.

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