Electrochemical behaviour of lead-free Sn–0.7Cu–xIn solders alloys in 3.5 wt% NaCl solution

Study on the preparation and properties of Sn–0.7Cu–xBi alloy

“…Then, these corrosion products covered the surface to prevent further corrosion of the alloy, and a plateau area (CD) appeared on the curve. 22 When the potential reached point D, the current density increased signicantly, indicating the breakdown of the passive lm.…”