Effect of Aging on Dendritic Array, Ag3Sn Spacing, and Hardness of a Sn-2Ag-0.7Cu Solder Alloy

Silva, Bismarck Luiz; Mendes, Pedro Henrique; Garcia, Amauri; Spinelli, José Eduardo

doi:10.1007/s11664-022-09713-5

Cited by 3 publications

(3 citation statements)

References 24 publications

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“…The cellular ( λ C —sample: 5 mm) and primary ( λ 1 ) dendritic spacing values ranged from 36.6 to 267.7 μm related to positions in the DS casting in the range 5–90 mm from the metal/mold interface, respectively. This type of (cellular) growth has been also observed by Silva and co‐workers [ 30 ] for Sn–Cu–Ni alloys, by Xavier et al [ 33 ] for Sn–Ni alloys, and by Spinelli et al [ 32 ] for Bi–Ag alloys.…”

Section: Resultssupporting

confidence: 77%

“…The cellular/dendritic transition occurred gradually around the position 5 mm from the metal/mold interface, with cooling rate and growth rate of 8.55 °C s À1 and 1.15 mm s À1 , respectively. The occurrence of cellular/dendritic transition was reported by other authors such as Silva and co-workers [30] for DS Sn-0.7 wt% Cu, Sn-0.7 wt% Cu-0.05 wt% Ni, and Sn-0.7 wt% Cu-0.1 wt% Ni alloys castings. The transition occurred at the positions 20, 6, and 5 mm for cooling rates and growth rates of 1.2, 5.9, and 6.0 °C s À1 and 0.4, 0.75, and 0.82 mm s À1 , respectively.…”

Section: Macrostructures As-cast Microstructures Andsupporting

confidence: 74%

“…[25] The cross and longitudinal sections were used for the measurement of λ EC and λ 1 , and λ 2 and λ 3 , respectively, as shown in Figure 3. The measurement procedure was performed by using the ImageJ image processing software, where samples from different positions (5,10,15,20,30,50,70, and 90 mm from the metal/mold interface) were analyzed along the length of each Sn-Ag(-Zn) DS castings. At least 40 measurements were obtained, with the computation of mean and standard deviations values.…”

Section: Microstructural Characterizationmentioning

confidence: 99%

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Effects of Zn Addition on Dendritic/Cellular Growth, Phase Formation, and Hardness of a Sn–3.5 wt% Ag Solder Alloy

et al. 2022

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Sn-Ag-based alloys are considered good alternatives to soldering operations as compared with the traditional Sn-Pb solder alloys. Herein, the effects of 0.5 and 1.0 wt% Zn additions to a Sn-3.5 wt% Ag eutectic alloy on cooling and growth rates, microstructure, and microhardness along the length of directionally solidified (DS) castings are examined. Characterization techniques such as optical microscopy (OM), scanning electron microscopy (SEM), X-ray fluorescence (XRF), X-ray diffraction (XRD), and Vickers microhardness are used to examine different samples extracted along the length of the DS castings. The Sn-3.5 wt% Ag alloy is shown to have a fully dendritic microstructure, characterized by a Sn-rich matrix with the eutectic mixture located in the interdendritic regions. On the other hand, the alloy modified with 1 wt% Zn exhibits a microstructure entirely formed by β-Sn cells, with a mixture of β-Sn, ε-Ag 3 Sn, and ζ-AgZn phases in the intercellular regions. The DS Sn-3.5 wt% Ag-0.5 wt% Zn alloy casting exhibits a cellular/dendritic transition at a critical cooling rate of 8.5 °C s À1 . The 0.5 wt% and 1 wt% Zn additions to the Sn-3.5 wt% Ag alloy improve hardness by 42.6% and 47.5%, respectively.

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Section: Resultssupporting

confidence: 77%

Section: Macrostructures As-cast Microstructures Andsupporting

confidence: 74%

Section: Microstructural Characterizationmentioning

confidence: 99%

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Effects of Zn Addition on Dendritic/Cellular Growth, Phase Formation, and Hardness of a Sn–3.5 wt% Ag Solder Alloy

et al. 2022

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Dendrite Growth in Single-Grain and Cyclic-Twinned Sn–3Ag–0.5Cu Solder Joints

Sun,

Gourlay

2024

Metall Mater Trans A

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The microstructure of electronic solder joints is generated by the solidification of a small volume of bulk undercooled liquid. Here, we study β-Sn dendrite growth in Sn–3Ag–0.5Cu in the specific geometry and nucleation conditions of ball grid array (BGA) solder joints by combining electron backscatter diffraction and imaging of microstructures. It is shown that, while $$\langle 110\rangle$$ ⟨ 110 ⟩ is the preferred dendrite growth direction, out-of-plane branching and growth with $$\langle 11W\rangle$$ ⟨ 11 W ⟩ directions are important for allowing dendrites to fan out into the spheroidal volume of BGA joints due to the low symmetry of β-Sn. We find that the crystallographic orientation of β-Sn at the nucleation point plays a strong role in subsequent dendrite growth. In single-grain joints, dendrites are often unfavorably oriented for growth, resulting in different types of zig-zag dendrite growth. In cyclic-twinned joints, it is shown how competitive out-of-plane trunk growth between three dendrite orientations produces {101} boundaries and the characteristic beachball microstructure.

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Quantitative Microstructural Data of Bulk Solders and Joints under a New Framework of MicroStructure Hierarchy Descriptor (μSHD)

Zheng,

Huang,

Xiao

et al. 2023

2023 24th International Conference on Electronic Packaging Technology (ICEPT)

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Effect of Aging on Dendritic Array, Ag3Sn Spacing, and Hardness of a Sn-2Ag-0.7Cu Solder Alloy

Cited by 3 publications

References 24 publications

Effects of Zn Addition on Dendritic/Cellular Growth, Phase Formation, and Hardness of a Sn–3.5 wt% Ag Solder Alloy

Effects of Zn Addition on Dendritic/Cellular Growth, Phase Formation, and Hardness of a Sn–3.5 wt% Ag Solder Alloy

Dendrite Growth in Single-Grain and Cyclic-Twinned Sn–3Ag–0.5Cu Solder Joints

Quantitative Microstructural Data of Bulk Solders and Joints under a New Framework of MicroStructure Hierarchy Descriptor (μSHD)

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