Dendrite Growth in Single-Grain and Cyclic-Twinned Sn–3Ag–0.5Cu Solder Joints
S. Sun,
C. M. Gourlay
Abstract:The microstructure of electronic solder joints is generated by the solidification of a small volume of bulk undercooled liquid. Here, we study β-Sn dendrite growth in Sn–3Ag–0.5Cu in the specific geometry and nucleation conditions of ball grid array (BGA) solder joints by combining electron backscatter diffraction and imaging of microstructures. It is shown that, while $$\langle 110\rangle$$
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