Effect of additives on microstructure and properties of the coarsened layer of very low profile (HVLP) copper foil

Influences of composite additives and technological parameters on the microstructure and properties of electrolytic copper foil

“…Since few previous studies on copper foil have been reported, it is found from the available experimental results that the main approach to depositing ultra-thin copper foils with the required properties and quality is to regulate the process parameters and to add additives [10,11]. Altering the technical parameters is the most direct, simple and easy-to-use way to improve the quality of copper foil [12,5]. Cao et al [13] investigated the effects of duty cycle, current density and electroforming time on the uniformity of copper layer thickness using the orthogonal experimental method, and suggested the optimal pulse reverse electroforming parameters.…”

“…Electrolytic copper foil, as the "neural network" of the signal of electronic products and the " uid collection" of lithium-ion batteries, is widely applied in various elds such as copper clad laminates (CCL), printed circuit boards (PCB) and lithium batteries [1][2][3]. Since 2017, as the production of smart consumer goods and new energy vehicles in China has gradually increased, the demand for electrolytic copper foil is growing, and the development trend of ultra-thin copper foil with high performance has been apparent [4][5][6]. This has undoubtedly brought unprecedented development opportunities to the copper foil industry.…”