Effect of a polyethoxylate surfactant on the electrodeposition of tin

A review of developments in the electrodeposition of tin

“…In this fashion, coumarin was able to self-regulate its concentration in the bath; its consumption being 0.01 g A -1 h -1 . 43 The addition of an octylphenol ethoxylate surfactant, Triton X-102 to tin electrolytes from a mixture of sulphuric and phenolsulfonic acid showed that the additive shifted the cell voltage from 0.4 V (0.035 g dm -3 additive) to 0.7 V (1 g dm -3 additive). 43 The increase in polarisation becomes detrimental as more energy is required for deposition.…”

“…43 The addition of an octylphenol ethoxylate surfactant, Triton X-102 to tin electrolytes from a mixture of sulphuric and phenolsulfonic acid showed that the additive shifted the cell voltage from 0.4 V (0.035 g dm -3 additive) to 0.7 V (1 g dm -3 additive). 43 The increase in polarisation becomes detrimental as more energy is required for deposition. When the additive level was below its critical micelle concentration (0.2 to 0.3 g dm -3 ), the active sites for preferential growth of tin deposits were blocked.…”

“…It has also been reported that voltage oscillations may be an indication of irregular growth of tin deposits such as dendrites. 43 The effect of aromatic ketones (benzalacetone, BA and benzophenone, BP) and N,Nbis(polyoxyethylene)octadecylamines, on tin deposition from sulphuric acid has been studied.…”

“…Table 2 shows examples of recent bath formulations. [7][8][9][10][11][12][13][14][15][16] Several recent investigations from our laboratory have been based on acidic electrolytes. Such baths contain sulphuric acid (molar mass: 98.1 g mol -1 ), methanesulfonic acid (molar mass:…”

Initial, Stages of Tin Electrodeposition from Sulphate-Tartrate Baths

“…The recent published studies about tin or tin alloy electrodeposition [12][13][14][15][16][17][18][19][20][21][22] are mainly focused in the study of the additives, the bath compositions and the plating variables which permit to obtain coatings for commercial uses, but only few results about the reduction kinetics of Sn(ll) obtained by chronoamperometric techniques were reported [23][24][25][26], In this study, the tin electrodeposition from a sulphate bath using tartrate as chelating agent was investigate by means of potentiodynamic and potentiostatic electrochemical techniques, in order to establish the influence of the electroplating variables in the earlier stages of tin deposit. The model of nucleation and growth of the earlier stages of tin deposits in a sulphate-tartrate bath will be obtained and these results will be compared with those obtained in a sulphate-gluconate bath [26],…”