Ecological comparison of soldering and sintering as die-attach technologies in power electronics

Braunwarth, Louisa; Amrhein, Sebastian; Schreck, Timo; Kaloudis, Michael

doi:10.1016/j.jclepro.2015.03.100

Cited by 7 publications

(5 citation statements)

References 9 publications

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“…Other packaging solutions such as flip chip (FC) or ball grid array (BGA), a typical type of surface-mount package (SMP) can provide improved heat dissipation, and hence, impact the device lifetime. For instance, an ecological comparison of soldering and sintering die-attach technologies shows that sintering has lower impacts when considering increased lifetime [34]. Therefore, further studies with detailed packaging life cycle inventories for different packaging solutions are necessary in order to assess the environmental impacts of a packaged GaN die.…”

Section: Impact Assessment Of the Packagingmentioning

confidence: 99%

Cradle-to-Gate Life Cycle Assessment (LCA) of GaN Power Semiconductor Device

Vauche,

Guillemaud,

Lopes Barbosa

et al. 2024

Sustainability

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Wide Band Gap (WBG) semiconductors have the potential to provide significant improvements in energy efficiency over conventional silicon (Si) semiconductors. While the potential for energy efficiency gains is widely researched, the relation to the energy and resource use during manufacturing processes remains insufficiently studied. In order to appraise the performance of the technology thoroughly, issues such as raw material scarcity, toxicity and environmental impacts need to be investigated in detail. However, sparse Life Cycle Assessment (LCA) data are available for the two currently most widespread WBG semiconductor materials, gallium nitride (GaN or GaN/Si) and silicon carbide (SiC). This paper, for the first time, presents a cradle-to-gate life cycle assessment for a GaN/Si power device. To allow for a full range of indicators, life cycle assessment method EF 3.1 was used to analyze the results. The results identify environmental hotspots associated with different materials and processes: electricity consumption for the processes and clean room facilities, direct emissions of greenhouse gases, gold (when used), and volatile organic chemicals. Finally, we compare this result with publicly available data for Si, GaN and SiC power devices.

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Section: Impact Assessment Of the Packagingmentioning

confidence: 99%

Cradle-to-Gate Life Cycle Assessment (LCA) of GaN Power Semiconductor Device

Vauche,

Guillemaud,

Lopes Barbosa

et al. 2024

Sustainability

View full text Add to dashboard Cite

show abstract

“…In addition to references [18,53] mentioned earlier, an LCA from cradle to grave, including end-of-life scenarios, has been conducted on a planar transformer [39], aluminum electrolytic capacitors [58], multi-layer ceramic capacitors and tantalum electrolytic capacitors [59], and electro-intensive power electronic products [60]. Furthermore, [26] presents a LCA in which the use of secondary raw materials, here silver in the sintering process, is taken into account.…”

Section: Design and Business Model For Circularitymentioning

confidence: 99%

“…Some works in the literature focus on the LCA of one part of the converter. This is the case of reference [26], which compares soldering and sintering processes for power modules, using Open-LCA and Recipe. Reference [27] presents a very pragmatic view of the LCA of a cooking induction module, and in particular its electronic board.…”

mentioning

confidence: 99%

State of the Art of Research towards Sustainable Power Electronics

Salomez,

Helbling,

Almanza

et al. 2024

Sustainability

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Sustainability in power electronics is a recent research topic. It takes place among current actions to grasp design choices that enable eco-design and circular economy in the domain. This paper shows the results and analysis of a literature review at the intersection of power electronics and sustainability without considering the reliability study of the power electronics systems. The first part explains the scope of the study. The second part shows a bibliometric analysis of the collected publications that underlines a pioneering position at the European level. The third part details the state-of-the-art and its analysis over four investigation topics which are: tools and methods, indicators, circularity and materials. This paper and the work behind are the results of collaboration at the French national level, as part of the workgroup CEPPS (Convertisseurs Electronique de Puissance Plus Soutenables—More Sustainable Power Electronics Converters) supported by the CNRS (Centre National de la Recherche Scientifique—French National Centre for Scientific Research) research group SEEDS (Systèmes d’énergie électrique dans leurs dimensions sociétales—Societal dimensions of electrical energy systems).

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“…For example, hot pressing and brazing can generate high temperatures and pressures that may require high energy consumption. Sintering and soldering can produce toxic fumes, gases, or vapors that can affect the health of the workers or the environment . Electroplating and polymeric bonding can use hazardous chemicals, solvents, or catalysts that can pollute nature…”

Section: Manufacturing Process Of Cmp Consumables and Their Possible ...mentioning

confidence: 99%

Environmental Impact Assessment of Chemical Mechanical Planarization Consumables: Challenges, Future Needs, and Perspectives

Venkataswamy,

Trimble,

McDonald

et al. 2024

ACS Sustainable Chem. Eng.

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This paper provides a detailed overview of the environmental impacts and sustainability of chemical mechanical planarization (CMP) consumable manufacturing in the semiconductor industry, especially in the context of rising global demand for semiconductors. It addresses the significant environmental challenges faced by the industry, particularly in terms of energy, water, and material consumption. A thorough examination of the manufacturing processes for key CMP consumables, such as slurries, pads, brushes, cleaning solutions, and conditioners, is discussed. The environmental impact of each process highlights the considerable role CMP consumables play in the industry's overall environmental footprint. The production of CMP slurries and pads is particularly energy-and water-intensive, uses hazardous materials, and significantly contributes to greenhouse gas emissions and resource depletion. While the environmental impacts of PVA brushes, cleaning solutions, and conditioners are relatively minor, their production still requires careful consideration. In response to these challenges, this paper proposes a vision for future CMP sustainability analysis, emphasizing a collaborative approach among chipmakers, consumable manufacturers, and academic institutions to enable the understanding of the environmental impacts of different materials used in consumable manufacturing and assist in the selection of environmentally friendly options. We highlight an urgent need for the CMP community to adopt comprehensive sustainability practices with a particular focus on consumable manufacturing.

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Ecological comparison of soldering and sintering as die-attach technologies in power electronics

Cited by 7 publications

References 9 publications

Cradle-to-Gate Life Cycle Assessment (LCA) of GaN Power Semiconductor Device

Cradle-to-Gate Life Cycle Assessment (LCA) of GaN Power Semiconductor Device

State of the Art of Research towards Sustainable Power Electronics

Environmental Impact Assessment of Chemical Mechanical Planarization Consumables: Challenges, Future Needs, and Perspectives

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