2012
DOI: 10.1186/1556-276x-7-241
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Early stages of growth of gold layers sputter deposited on glass and silicon substrates

Abstract: Extremely thin gold layers were sputter deposited on glass and silicon substrates, and their thickness and morphology were studied by Rutherford backscattering (RBS) and atomic force microscopy (AFM) methods. The deposited layers change from discontinuous to continuous ones for longer deposition times. While the deposition rate on the silicon substrate is constant, nearly independent on the layer thickness, the rate on the glass substrate increases with increasing layer thickness. The observed dependence can b… Show more

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Cited by 58 publications
(44 citation statements)
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“…It can be observed from the RBS spectra and the obtained areal density value that the film is fairly thick. Expectedly, barring variation in other process parameters, the layer thickness is predictably an increasing function of deposition time [16]. Therefore, to deposit a film with lower thickness, the deposition time should be reduced.…”
Section: Rutherford Backscattering Spectroscopy Analysismentioning
confidence: 99%
“…It can be observed from the RBS spectra and the obtained areal density value that the film is fairly thick. Expectedly, barring variation in other process parameters, the layer thickness is predictably an increasing function of deposition time [16]. Therefore, to deposit a film with lower thickness, the deposition time should be reduced.…”
Section: Rutherford Backscattering Spectroscopy Analysismentioning
confidence: 99%
“…However, these normal metal coating methods suffer from extreme surface roughness. Considering this fact, chemical vapor deposition (CVD) [27] is an efficient method that offers uniform nanolayer coating with minimal surface roughness. Metal nanoparticles can also be used by maintaining their size during fabrication to obtain a thin and smooth coating surface [26].…”
Section: Design Guidelines and Numerical Methodsmentioning
confidence: 99%
“…A reduction of this lower limit for the thickness can be achieved by improving the adhesion between Au and the substrate. The current value for this limit is between 10 and 15 nm [8,9]. The usual approach for adhesion improvement is using Ti or Cr layers.…”
mentioning
confidence: 99%