Early stage growth characteristics of Ag 3 Sn intermetallic compounds during solid–solid and solid–liquid reactions in the Ag–Sn interlayer system: Experiments and simulations

Lis, Adrian; Park, Min Soo; Arróyave, Raymundo; Leinenbach, Christian

doi:10.1016/j.jallcom.2014.08.082

Cited by 57 publications

(25 citation statements)

References 38 publications

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“…[25] The growth kinetics for 523 K and 573 K (250°C and 300°C) diverge in the second characteristic time regime (t tot > 180 seconds). The parabolic growth constants can be described by an Arrhenius relationship:…”

Section: B Derivation Of Processing Mapsmentioning

confidence: 98%

“…The height of the thermocouple, i.e., the distance between the heating plate and measuring point, was chosen to be consistent with the height of the specimen (4). The temperature measurement had an uncertainty of +/À1 K. The same experimental setup was used in our previous study on Ag-Sn interfacial reactions, [25] where it is described in detail.…”

Section: A Experimental Setup and Processingmentioning

confidence: 99%

“…This transporting mechanism leads to the wellknown scallop-like IMC morphology observed in Ag-Sn or Cu-Sn systems. [11,25,26] By contrast, the formation of faceted Ni 3 Sn 4 IMC has been monitored in various studies. [19,20,22,23] Generally, a phase facets when it is difficult for atoms to attach from the liquid state to a nucleated solid layer.…”

Section: A Morphological Evolution Of Ni 3 Sn 4 Imcmentioning

confidence: 99%

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Characteristics of Reactive Ni3Sn4 Formation and Growth in Ni-Sn Interlayer Systems

Lis

Kenel

Leinenbach

2016

Metall Mater Trans A

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The near-isothermal growth and formation of Ni 3 Sn 4 intermetallic compounds (IMC) in Ni-Sn interlayer systems was studied in the solid state at 473 K (200°C) and under solid-liquid conditions at 523 and 573 K (250°C and 300°C) from an initial state of a few seconds. Scalloped solid-state IMC formation was mainly driven by grain boundary diffusion of Ni through the IMC layer combined with the grain coarsening of the IMC layer. Under solid-liquid conditions, the formation of faceted and needle-shaped Ni 3 Sn 4 grains as well as an atypical IMC growth behavior with similar parabolic growth constants for 523 K and 573 K (250°C and 300°C) was observed within the first 180 seconds of the holding time, and IMC growth occurred as an isothermal solidification from the Ni-saturated Sn melt. Due to the progressive densification of the IMC layer and the diffusion-controlled growth, the kinetics slowed down by approximately one order of magnitude after 180 seconds of annealing. The final stage was characterized by the formation of IMC islands ahead of the interfacial Ni 3 Sn 4 layer. Needle-like IMC growth was effectively suppressed under combined solid-state and solid-liquid conditions. Textured Ni 3 Sn 4 IMC formation at the Ni-Sn interface was approved with pole figure measurements. The activation energy Q for solid-liquid IMC formation was calculated as 43.3 kJ/mol, and processing maps for IMC growth and Sn consumption were derived as functions of temperature and time, respectively.

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Section: B Derivation Of Processing Mapsmentioning

confidence: 98%

Section: A Experimental Setup and Processingmentioning

confidence: 99%

Section: A Morphological Evolution Of Ni 3 Sn 4 Imcmentioning

confidence: 99%

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Characteristics of Reactive Ni3Sn4 Formation and Growth in Ni-Sn Interlayer Systems

Lis

Kenel

Leinenbach

2016

Metall Mater Trans A

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“…Once the liquid Sn was completely consumed, Ag 3 Sn grain growth was supported by the solid-state diffusion of Ag and Sn atoms. [26] …”

Section: Ag@sn Interface Analysismentioning

confidence: 99%

Ag@Sn Core‐Shell Powder Preform with a High Re‐Melting Temperature for High‐Temperature Power Devices Packaging

Wang

Guo

et al. 2017

Adv Eng Mater

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In this paper, the authors propose a highly conductive die attach material based on Ag@Sn powder for power devices operating at high temperatures or in other harsh environments. The preform can be reflowed at 250 C (18 C above the T m of Sn, 232 C), but the resulting bondline can sustain high temperatures up to 400 C with a high shear strength due to the high re-melting temperature of the formed Ag 3 Sn (T m ¼ 480 C) after the complete consumption of the outer Sn layers. In addition, the formed bondline exhibits excellent electrical and thermal conductivities due to the embedded Ag particles in the interconnections. The interconnections also exhibit excellent reliability under thermal shock cycling from À55 to 200 C because of the increased bondline thickness and inherent ductility of the Ag particles embedded in the Ag 3 Sn.

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“…[12][13][14][15] For example, Park et al investigated the evolution of the Cu 3 Sn and Cu 6 Sn 5 intermetallic phases under electro-migration conditions, using a multiphase-field model. [16] Villanueva et al studied the growth of the intermetallic phase by incorporating fluid flow, phase change, and solute diffusion in the phase-field model.…”

Section: Introductionmentioning

confidence: 99%

Numerical and Experimental Investigations on the Growth of the Intermetallic Mg₂Si Phase in Mg Infiltrated Si‐Foams

et al. 2017

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The present work explores the growing behavior of the intermetallic layer in the Mg-Si system. Following achievements have been obtained in our investigation: (i) A complete wetting concept is proposed for the lateral spreading of the intermetallic layer. (ii) In contrast to the stoichiometric property for the intermetallic phase in the phase diagram, the authors show that concentration gradients are able to be established in the kinetic process. (iii) Contrary to the reported growth behavior, d / t 0.25-0.5 in other intermetallics, the authors find a transition from d / ffiffi t p to d / t with an increase of the temperature, where d is the thickness of the intermetallic layer and t is the time.

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Early stage growth characteristics of Ag 3 Sn intermetallic compounds during solid–solid and solid–liquid reactions in the Ag–Sn interlayer system: Experiments and simulations

Cited by 57 publications

References 38 publications

Characteristics of Reactive Ni3Sn4 Formation and Growth in Ni-Sn Interlayer Systems

Characteristics of Reactive Ni3Sn4 Formation and Growth in Ni-Sn Interlayer Systems

Ag@Sn Core‐Shell Powder Preform with a High Re‐Melting Temperature for High‐Temperature Power Devices Packaging

Numerical and Experimental Investigations on the Growth of the Intermetallic Mg₂Si Phase in Mg Infiltrated Si‐Foams

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Early stage growth characteristics of Ag 3 Sn intermetallic compounds during solid–solid and solid–liquid reactions in the Ag–Sn interlayer system: Experiments and simulations

Cited by 57 publications

References 38 publications

Characteristics of Reactive Ni3Sn4 Formation and Growth in Ni-Sn Interlayer Systems

Characteristics of Reactive Ni3Sn4 Formation and Growth in Ni-Sn Interlayer Systems

Ag@Sn Core‐Shell Powder Preform with a High Re‐Melting Temperature for High‐Temperature Power Devices Packaging

Numerical and Experimental Investigations on the Growth of the Intermetallic Mg2Si Phase in Mg Infiltrated Si‐Foams

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Numerical and Experimental Investigations on the Growth of the Intermetallic Mg₂Si Phase in Mg Infiltrated Si‐Foams