Alkyl ligands with an amine or thiol headgroup have been
chosen
to investigate their effectiveness in preventing copper nanowire (Cu
NW) oxidation in hydrothermal and hygrothermal environments. Ligand
desorption has been found to be the key reason for Cu NWs to oxidize
in a wet environment. Alkylamines interact with Cu NWs through weak
coordination bonding, which would desorb easily, rendering Cu NWs
prone to oxidation. Adding excess alkylamines in the aqueous solution
can suppress the Cu NW oxidation, and keep the Cu NWs oxidation-free
upon solution processing and long-term storage. In contrast, alkylthiols
can strongly bind on Cu NW surfaces through thiolate bonding, which
provides better oxidation protection than alkylamines even in hydrothermal
and hygrothermal environments. Furthermore, it has been found that
for the alkyl chains containing 12 carbons or longer, the alkyl chain
length would have little effect on the oxidation-resistant properties
of Cu NWs when the ligands are strongly bound to Cu NW surfaces. In
addition to oxidation resistance, a shorter alkyl chain length is
found to favor current transport between Cu NWs for potential applications
in transparent flexible electronics and autonomous vehicles.