Dynamic wetting and heat transfer at the initiation of aluminum solidification on copper substrates

Bouchard, D.; Leboeuf, Sébastien; Nadeau, Jean-Paul; Guthrie, R. I. L.; Isac, Mihaiela

doi:10.1007/s10853-008-2888-3

Cited by 20 publications

(6 citation statements)

References 23 publications

(38 reference statements)

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“…On very smooth substrate surface, the peak heat flux has a higher value than that on rough surface. The similar results have been reported in some researchers' works [4][5]9] . The interfacial heat flux in the second stage (solidified shell developing stage) is almost the same.…”

Section: Heat Flux Calculationsupporting

confidence: 92%

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Determination of interfacial heat flux of stainless steel solidification on copper substrate during the first 0.2 s

Zhang

Yuan

et al. 2011

J. Shanghai Jiaotong Univ. (Sci.)

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Interfacial heat transfer is a key issue in many solidification processes. In the paper, a novel experimental apparatus has been designed and on this basis, the instantaneous interfacial heat transfer between molten steel or solidified shell and copper substrate during the first 0.2 s has been studied. The investigated parameters include melt superheat, substrate temperature and surface roughness. The results show that the peak value of the interfacial heat flux in the first stage of liquid/solid contact increases with melt superheat and changes slightly with substrate temperature and surface roughness. The interfacial heat flux in the stage of solid/solid contact has a similar trend of slow decrease in most conditions.It is self-evident that the interfacial heat transfer between molten metal and molds in the solidification processes is very important to casting. Most of the previous work [1][2][3] concentrated on the determination of interfacial heat transfer between casting and metal or sand molds in quite a long time, for example, from seconds to minutes. However, in many rapid or near rapid solidification processes, such as strip casting, the total solidification time is less than 0.5 s. Recently, studies on the interfacial heat transfer of initial solidification in fragments of second have been paid more attentions, but the materials most used in experiments are low melting point metals and alloys, such as aluminum alloy. For the high melting point alloys with high commercial value such as steel, studies on instantaneous interfacial heat transfer in solidification have not been intensively carried out.The solidification process of melt on metal substrate surface can be divided into two stages: liquid/solid contact and solid/solid (S/S) contact. In the first contact stage, a low interfacial thermal resistance and a high interfacial heat flux occur due to the better wettability condition between liquid and solid. In the S/S contact stage, the thermal resistance increases and the heat flux decreases owing to air gaps formed between the solidified shell and the substrate.Accurate determination of instantaneous interfacial heat transfer can not only expand our understanding on initial solidification, but also provide boundary conditions for numerical simulation. However, there are many difficulties in this problem. The high melt temperature results in no proper thermocouples which can be placed in the melt; the short solidification time requires quick response time of the temperature measurement parts; the high value and the great change of the heat flux result in a great temperature change in the substrate. It requires proper design of the substrate and the temperature measurement to insure good resolving power for the initial interfacial heat transfer.Various apparatuses and simulators have been developed to study this problem. In these experiments, the droplet solidification method was used most widely [4][5][6][7][8] . In a typical experimental process, a melt droplet was molten and dripped onto a metal subst...

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Section: Heat Flux Calculationsupporting

confidence: 92%

“…In these experiments, the droplet solidification method was used most widely [4][5][6][7][8] . In a typical experimental process, a melt droplet was molten and dripped onto a metal substrate surface, and then solidified to an ingot.…”

mentioning

confidence: 99%

Determination of interfacial heat flux of stainless steel solidification on copper substrate during the first 0.2 s

Zhang

Yuan

et al. 2011

J. Shanghai Jiaotong Univ. (Sci.)

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“…As the length, δ, of the solidified layer near trijunction is much smaller than the drop diameter, 1D analysis suffices for addressing this problem. In addition, the classical solidification model is used in the literature for the drop-solidification problem. ,− We use the same model to find the growing length of the solid form, δ( t ), starting from the contact line where t is time from the onset of solidification and α is thermal diffusivity.…”

Section: Resultsmentioning

confidence: 99%

Spreading and Arrest of a Molten Liquid on Cold Substrates

2014

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Understanding the spreading and solidification of liquids on cold solid surfaces is a problem of fundamental importance and general utility. The physics of nonisothermal spreading followed by phase change is still a mystery. The present work focuses on the dynamics and thermal characteristics of liquid drop spreading and their subsequent arrest due to freezing. The spreading of liquid is recorded, and the evolution of the liquid spreading diameter and liquid-solid contact angle is measured from the recordings of a high-speed digital camera. After the initiation of solidification, the liquid drops are pinned to the substrate, showing fixed footprints and contact angles. A physical hypothesis using scaling is provided to explain the relationship between the arrested base diameter (D*) and arrested contact angle (θ*) with respect to the Stefan number (Ste). The experimental observations of solidified drops on cold substrates corroborate the derived physical theory.

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“…Transfer The maximum heat flux is a quantitative reflection of the effectiveness of initial melt/substrate contact. 43) Thus, an increase of the maximum heat flux demonstrates that the deposited films promote the effectiveness of the initial melt/ substrate contact condition.…”

Section: Effects Of Deposited Films and Superheat On Heatmentioning

confidence: 93%

Interactive Relationship between the Superheat, Interfacial Heat Transfer, Deposited Film and Microstructure in Strip Casting of Duplex Stainless Steel

et al. 2019

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Dynamic wetting and heat transfer at the initiation of aluminum solidification on copper substrates

Cited by 20 publications

References 23 publications

Determination of interfacial heat flux of stainless steel solidification on copper substrate during the first 0.2 s

Determination of interfacial heat flux of stainless steel solidification on copper substrate during the first 0.2 s

Spreading and Arrest of a Molten Liquid on Cold Substrates

Interactive Relationship between the Superheat, Interfacial Heat Transfer, Deposited Film and Microstructure in Strip Casting of Duplex Stainless Steel

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