“…Figure 1 shows a temperature dependence of the experimental viscosity for the liquid SAC387 (Ag 3.8 Cu 0.7 Sn 95.5 ) alloy together with the literature data (Ref 30, 31). The viscosity values from Ref 31 were digitized.Fig.…”
Section: Resultsmentioning
confidence: 83%
“…The viscosity values from Ref 31 were digitized.Fig. 1Temperature dependence of the viscosity of liquid SAC387 reference alloy…”
The viscosity and electrical conductivity as structure-sensitive transport properties of the liquid metals and alloys are important for modeling of the melting and solidification processes. The viscosity and electrical conductivity data provide additional information about the influence of impurities on the structure and physicochemical properties of the liquid metal matrix, which is useful for understanding of structural transformations in the liquid state. In the present work, an impact of minor Co admixtures on the viscosity and electrical conductivity of liquid Sn-3.8Ag-0.7Cu alloy was studied. An increase in viscosity with minor Co admixtures is in a satisfactory agreement with model predicted data obtained from thermodynamic approaches and suggests a significant impact of interatomic interactions. Cobalt admixtures significantly affect the electrical conductivity, which gradually decreases with increasing the amount of Co. Additionally, the sample microstructure has been examined using x-ray diffraction and scanning electron microscopy analyses. The formation of Sn-based Co-Sn intermetallic compounds was detected in the alloys with more than 1 wt.% Co.
“…Figure 1 shows a temperature dependence of the experimental viscosity for the liquid SAC387 (Ag 3.8 Cu 0.7 Sn 95.5 ) alloy together with the literature data (Ref 30, 31). The viscosity values from Ref 31 were digitized.Fig.…”
Section: Resultsmentioning
confidence: 83%
“…The viscosity values from Ref 31 were digitized.Fig. 1Temperature dependence of the viscosity of liquid SAC387 reference alloy…”
The viscosity and electrical conductivity as structure-sensitive transport properties of the liquid metals and alloys are important for modeling of the melting and solidification processes. The viscosity and electrical conductivity data provide additional information about the influence of impurities on the structure and physicochemical properties of the liquid metal matrix, which is useful for understanding of structural transformations in the liquid state. In the present work, an impact of minor Co admixtures on the viscosity and electrical conductivity of liquid Sn-3.8Ag-0.7Cu alloy was studied. An increase in viscosity with minor Co admixtures is in a satisfactory agreement with model predicted data obtained from thermodynamic approaches and suggests a significant impact of interatomic interactions. Cobalt admixtures significantly affect the electrical conductivity, which gradually decreases with increasing the amount of Co. Additionally, the sample microstructure has been examined using x-ray diffraction and scanning electron microscopy analyses. The formation of Sn-based Co-Sn intermetallic compounds was detected in the alloys with more than 1 wt.% Co.
“…20) The filling depth of Sn melt infiltrated for 5 s into a Si viahole of 25 µm-radius, if it is an open capillary, at external pressures of 0.3, 0.5, 1 and 2 MPa would be estimated as 0.29, 0.43, 0.67 and 0.98 m, respectively. However, the length of the Sn via actually formed at each external pressure of 0.3, 0.5, 1 and 2 MPa was much shorter than the filling depth x estimated by eq.…”
Formation of through-silicon-via (TSV) was examined by pressure infiltration of molten Sn into Si via-holes with variations of the infiltration pressure, infiltration time and via-hole size. Contrary to the conventional Cu TSV process which requires complicate and long Cu electroplating, the method using pressure infiltration of molten Sn is fast enough to complete via-filling within 5 s regardless of the via-hole size. The ratio of the unfilled volume to the initial volume of a via-hole versus the external infiltration pressure well satisfied the Boyle's law. TSVs of different diameters in a wide range of 10200 µm could be easily formed at once by infiltration of molten Sn at an external pressure of 4 MPa for 5 s.
“…A considerable e®ort has been invested by researchers in numerous experimental studies to quantify the composition and temperature dependence of the viscosity of a number of simple and complex alloy systems. Dynamic viscosities of pure tin and Sn-Ag, Sn-Cu and SnAg-Cu eutectic alloy melts were studied by Rozhitsina et al 9 Very recently, the viscosity of the liquid Sn-3.8 Ag-0.7Cu has been investigated by Yakymovych et al…”
Some physicochemical properties such as surface tension, molar volume, density and viscosity of liquid Sn-Ag-Cu alloys have been calculated using Kohler, Muggianu, Toop and Hillert geometrical models along three cross-sections namely x Ag /x Cu ¼ 1=2, 1/1 and 2/1. Indeed, Guggenheim, Kozlov-Romanov-Petrov and Kaptay equations have also been extended to estimate the surface tension and viscosity based on the thermodynamic data of the investigated system over wide temperature ranges of 823-1123 K and 773-1173 K, respectively. The results show that the three investigated properties, surface tension, density and viscosity, decrease with increasing tin for all studied models. On the other hand, a di®erent behavior of these properties as a function of the temperature was noted. This evolution depends on the composition of the studied alloys.On the contrary, the molar volume increases with increase of temperature and tin compositions. It should be noted that the surface tension, density and molar volume show a linear dependence on temperature for all the investigated compositions. For viscosity, a curvilinear dependence has been observed. The calculated surface tensions and densities were compared with those reported experimentally for Sn-Ag-Cu alloys along the cross-section x Ag /x Cu ¼ 1/1.
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