Dynamic Performance at Inner Tip of an Interfacial Crack near a Circular Cavity in Piezoelectric Bi-Materials

Abstract

In transversely isotropic piezoelectric bi-materials, a theoretical analysis is followed to calculate the dynamic stress intensity factors (DSIFs) due to existence of a permeable interfacial crack, near the edge of a circular cavity. The model is subjected to dynamic incident anti-plane shearing (SH-wave) and Green's function method is the base of formulation. Conjunction and crack-simulation techniques are applied to obtain DSIFs at the crack’s inner tip. Calculations are prepared based on FORTRAN language program. For calibration of program, a comparison is accomplished between the present model and another with a crack emerging from the cavity edge. Calculating results clarified the influences of the physical parameters, the structural geometry and the wave frequencies on the dimensionless DSIFs and how those affected the efficiency of piezoelectric devices and materials.

Identification of an elliptic void in a piezoelectric layer by two types of loads

“…First is Pan and Han’s study [17] in which they presented Green’s functions for transversely isotropic piezoelectric and layered half-space. The second study is by Song and Tianshu [18] in which the dynamics of cavities near the horizontal boundary related to piezoelectric materials were investigated. Zhang et al [19] considered a combination of a piezoelectric layer with a polymeric layer and a PZP-5H ceramic layer with a polythene layer.…”