Dynamic critical curve of a synthetic antiferromagnet

Pham, Huy; Cimpoesu, Dorin; Plamadă, Andrei-Valentin; Stancu, Alexandru; Spînu, Leonard

doi:10.1063/1.3265739

Cited by 10 publications

(3 citation statements)

References 52 publications

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“…Thus, if the magnitude of IEC strength is represented by J, then in case of ferromagnetic coupling between the FM layers 'J>0' and for antiferromagnetic coupling (AFM) 'J<0'. Furthermore, the high-speed response and thermal stability of spintronic devices can also be greatly influenced by the strength and sign of the IEC [23][24][25]. The experimental demonstration of exchange coupling between laterally adjacent nanomagnets based on interlayer coupled multilayers, was shown for the first time in [14].…”

Section: Theoretical Backgroundmentioning

confidence: 99%

A novel and reliable interlayer exchange coupled nanomagnetic universal logic gate design

Mattela¹,

Debroy²,

Sivasubramani³

et al. 2020

Nanotechnology

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In this paper, we propose an interlayer exchange coupling (IEC) based 3D universal NAND/NOR gate design methodology for the reliable and robust implementation of nanomagnetic logic design as compared to the state-of-the art architectures. Owing to stronger coupling scheme as compared to the conventional dipole coupling, the random flip of the states of the nanomagnets (i.e. the soft error) is reduced resulting in greater scalability and better data retention at the deep sub-micron level. Results obtained from Object Oriented Micromagnetic Framework micromagnetic simulation show even at a Curie temperature of the nanomagnets coupled through IEC, the logic function works properly as opposed to dipole coupled nanomagnets which fails at 5 K when scaled down to sub 50 nm. Contemplating the fabrication challenges, the robustness of the IEC design was studied for structural defects, positional misalignment, shape, and size variations. This proposed 3D universal gate design methodology benefits from the miniaturization of nanomagnets as well as reduces the effect of thermally induced errors resulting in opening up a new perspective for nanomagnet based design in magneto-logic devices.

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Section: Theoretical Backgroundmentioning

confidence: 99%

A novel and reliable interlayer exchange coupled nanomagnetic universal logic gate design

Mattela¹,

Debroy²,

Sivasubramani³

et al. 2020

Nanotechnology

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“…The idea is analogous to the one employed in nano-magnetic logic, but instead of using soliton motion in dipolar coupled nanomagnets positioned on the substrate plane, solitons are moved perpendicularly to the substrate plane in magnetic superlattices, where the coupling between magnetic thin films is provided by non-magnetic spacers via antiferromagnetic RKKY interactions. When such films are separated by a nonmagnetic, metallic spacer layer, both the sign and the magnitude of the exchange coupling becomes sensitive to the layer thickness [24][25][26].…”

Section: Introductionmentioning

confidence: 99%

Interlayer exchange couple based reliable and robust 3-input adder design methodology

Mattela¹,

Debroy²,

Sivasubramani³

et al. 2021

Nanotechnology

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In this paper, a novel inter-layer exchange coupled (IEC) based 3-input full adder design methodology is proposed and subsequently the architecture has been implemented on the widely accepted micromagnetic OOMMF platform. The impact of temperature on the IEC coupled full-adder design has been analyzed up to Curie temperature. It was observed that even up to Curie temperature the IEC based adder design was able to operate at sub-50 nm as contrast to dipole coupled adder design which failed at 5 K for sub 50 nm. Simulation results obtained from OOMMF micromagnetic simulator shows, the IEC based adder design was at a lower energy state as compared to the dipole coupled adder indicating a more stable system and as the temperature of the design was increased, the total energy increased resulting in reduced stability. Potential explanation for the thermodynamic stability of IEC model lies in its energetically favored architecture, such that the total energy was lower than its dipole coupled counterparts. IEC architecture demonstrates supremacy in reliability and strength enabling NML to march towards beyond CMOS devices.

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“…Devices utilizing SAF as a component have also been investigated through FMR to study the different aniso tropies among device layers [32]. A dynamic generalization of static CC for SAF structures was theoretically proposed in [33] for SAF elements subjected to pulsed magnetic fields, showing the possibility of the reduction of the switching field amplitude by varying the pulse shape and length.…”

Section: Introductionmentioning

confidence: 99%

Critical switching curves of FeCoB synthetic antiferromagnets

Adams

Cimpoesu

Khan

et al. 2018

J. Phys. D: Appl. Phys.

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Magnetization dynamics in a synthetic antiferromagnet with magnetic layers of FeCoB were investigated through microwave absorption spectroscopy. Resonant absorption signal detected along different directions in the plane of the films was analyzed through a graphical representation reminiscent of the critical switching curves. The advantage of this representation is that anisotropy and coupling effects can be determined by inspection. Further, this data can then be readily compared to the static switching curve which we obtained through reversible susceptibility measurements. The correlation between static and dynamic critical curves is supported by macrospin simulations.

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Dynamic critical curve of a synthetic antiferromagnet

Cited by 10 publications

References 52 publications

A novel and reliable interlayer exchange coupled nanomagnetic universal logic gate design

A novel and reliable interlayer exchange coupled nanomagnetic universal logic gate design

Interlayer exchange couple based reliable and robust 3-input adder design methodology

Critical switching curves of FeCoB synthetic antiferromagnets

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