Dynamic Behavior of Condenser Microphone Under the Influence of Squeeze Film Damping

Zawawi, Siti Aisyah; Hamzah, Azrul Azlan; Selvarajan, Reena Sri; Majlis, Burhanuddin Yeop; Mohd-Yasin, F.

doi:10.1109/smelec.2018.8481244

Cited by 2 publications

(1 citation statement)

References 17 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The ultimate goal of this project is to use the SiC diaphragm in a MEMS microphone to detect poisonous gasses [32][33][34]. The data from the indentation experiment show that the maximum load that the diaphragm could take before bursting is 3 mN.…”

Section: Suitability Of Elastic Diaphragm As Acoustic Sensormentioning

confidence: 99%

The Fabrication and Indentation of Cubic Silicon Carbide Diaphragm for Acoustic Sensing

et al. 2021

Self Cite

View full text Add to dashboard Cite

In this study, 550 nm thick cubic silicon carbide square diaphragms were back etched from Si substrate. Then, indentation was carried out to samples with varying dimensions, indentation locations, and loads. The influence of three parameters is documented by analyzing load-displacement curves. It was found that diaphragms with bigger area, indented at the edge, and low load demonstrated almost elastic behaviour. Furthermore, two samples burst and one of them displayed pop-in behaviour, which we determine is due to plastic deformation. Based on optimum dimension and load, we calculate maximum pressure for elastic diaphragms. This pressure is sufficient for cubic silicon carbide diaphragms to be used as acoustic sensors to detect poisonous gasses.

show abstract

Section: Suitability Of Elastic Diaphragm As Acoustic Sensormentioning

confidence: 99%

The Fabrication and Indentation of Cubic Silicon Carbide Diaphragm for Acoustic Sensing

et al. 2021

Self Cite

View full text Add to dashboard Cite

show abstract

Design and implementation of an acoustic-vibration capacitive MEMS microphone

et al. 2022

View full text Add to dashboard Cite

A novel acoustic-vibration capacitive microelectromechanical system microphone is designed, fabricated, and implemented in this paper. The new microphone consists of a rigid diaphragm and mass blocks sensitive to low-frequency vibratory and sound signals. This sensor takes advantage of the semiconductor technology to design the capacitance sensor structure by surface micromachining technology, and the inertial mass blocks are shaped using the bulk silicon micromachining technology. The structure of the anti-stiction-dimple array is designed and deployed at the bottom of the diaphragm and the backplate to avoid the risk of sensor failure by vibration stiction. The bottom and top of the backplate are designed with an anti-humidity hydrophobic insulation protective layer, which avoids adsorption of moisture and attachment of foreign particles. The thickness of the mass blocks can be controlled by the combination of the dry and the wet micromachining method, which is sensitive to different frequency responses. This study can design and produce wafer level silicon with high consistency. The inertial mass proposed in this research can be achieved through a 6 in. wafer process with >80% consistency when the thickness of the mass is around 300 μm. The sensing frequency can be reduced to below the 4 kHz frequency bandwidth with enhanced sensitivity in the ±0.5 dB range. Typical characteristic results show that the open-circuit sensitivity of the microphone is 12.63 mV/Pa (37.97 dBV/Pa) at 1 kHz (with 94 dB as the reference sound level). The total harmonic distortion and acoustic overload point are 0.21% and 121.2 dB sound pressure level, respectively. The electronic stethoscope is a typical application of this research, which can collect the characteristics and frequency spectrum of low-frequency cardiac vibration signals.

show abstract

Dynamic Behavior of Condenser Microphone Under the Influence of Squeeze Film Damping

Cited by 2 publications

References 17 publications

The Fabrication and Indentation of Cubic Silicon Carbide Diaphragm for Acoustic Sensing

The Fabrication and Indentation of Cubic Silicon Carbide Diaphragm for Acoustic Sensing

Design and implementation of an acoustic-vibration capacitive MEMS microphone

Contact Info

Product

Resources

About