Dual-functional graphene/carbon nanotubes thick film: Bidirectional thermal dissipation and electromagnetic shielding

Jia, Hui; Kong, Qingqiang; Yang, Xiaona; Xie, Lingling; Sun, Guohua; Leilei, Liang; Chen, Jing-Peng; Liu, Dong; Guo, Quangui; Chen, Cheng-Meng

doi:10.1016/j.carbon.2020.09.017

Cited by 74 publications

(32 citation statements)

References 57 publications

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“…2b, the peak at 1354 cm −1 corresponds to the D band, which is associated with graphene's disorder and defects caused by the sp 3 hybridized carbon. The characteristic peak of the G band at 1587 cm −1 is caused by the E 2g phonon of sp 2 -bonded carbon atoms [39]. The intensity ratio of D and G bands (I D /I G ) of MB-G/A is approximately 0.15, which is greater than that of G/A (0.09).…”

Section: Resultsmentioning

confidence: 86%

Molecule bridged graphene/Ag for highly conductive ink

Yan

Zhang

et al. 2022

Sci. China Mater.

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Printing is a method of additive manufacturing that can reduce material costs and environmental contamination during the fabrication process. Ag ink is commonly used in printed electronics, such as interconnects, inductors, and antennas. However, the high cost of noble Ag restricts its massive applications. To reduce the cost of the state-of-the-art Ag ink and realize large-scale manufacturing, we develop a molecule-bridged graphene/Ag (MB-G/A) composite to produce highly conductive and cost-effective paperbased electronics. Graphene can be used to substitute part of Ag nanoparticles to reduce costs, form a conducive percolation network, and retain a reasonable level of conductivity. We adopt cysteamine as a molecular linker, because it anchors on the surface of graphene via the diazonium reaction. Additionally, the thiol functional group on the other end of cysteamine can bond to a Ag atom, forming a molecular bridge between graphene and Ag and promoting electron transport between Ag and graphene. As a result, the maximum conductivity of MB-G/A inks can reach 2.0 × 10 5 S m −1 , enabling their successful application in various printable electronics. In addition, the optimum MB-G/A ink costs less than half as much as pure Ag inks, showing the great potential of MB-G/A ink in commercial electronic devices.

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Section: Resultsmentioning

confidence: 86%

Molecule bridged graphene/Ag for highly conductive ink

Yan

Zhang

et al. 2022

Sci. China Mater.

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“…Compared with our chemically reduced samples with the sequential hot press to further improve the compaction and thermal contacts between graphene sheets, GO reduction with annealing can lead to “air pockets” and different cluster sizes . In early studies, it is also noted that the annealing above 1273 K is critical to the thermal conductivity enhancement. , In 2020, Jia et al reported that further graphitization at 3073 K dramatically enhanced the thermal transport in hot-pressed rGO/CNT (25 wt % CNT loading) hybrid films. The room-temperature k || of hybrid films increased from 41.89 W/(m·K) right after hot press at 1273 K, to 323.64 W/(m·K) after further 1873 K annealing, and to 933.37 W/(m·K) with 3073 K annealing .…”

Section: Resultsmentioning

confidence: 94%

“…In early studies, it is also noted that the annealing above 1273 K is critical to the thermal conductivity enhancement. , In 2020, Jia et al reported that further graphitization at 3073 K dramatically enhanced the thermal transport in hot-pressed rGO/CNT (25 wt % CNT loading) hybrid films. The room-temperature k || of hybrid films increased from 41.89 W/(m·K) right after hot press at 1273 K, to 323.64 W/(m·K) after further 1873 K annealing, and to 933.37 W/(m·K) with 3073 K annealing . In this work, the k || values for Samples #2–7 are close to k || of 41.89 W/(m·K) for the initial hot-pressed sample reported by Jia et al…”

Section: Resultsmentioning

confidence: 99%

Small-Nanostructure-Size-Limited Phonon Transport within Composite Films Made of Single-Wall Carbon Nanotubes and Reduced Graphene Oxides

Chen

Yan

et al. 2021

ACS Appl. Mater. Interfaces

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Nanocarbon materials have been widely used for nanoelectronics and energy-related applications. In this work, composite films consisting of reduced graphene oxides (rGOs) and single-wall carbon nanotubes (SWCNTs) are synthesized and studied for their in-plane thermal conductivities. Different from pristine carbon nanotubes or graphene with decreased thermal conductivities above 300 K, the in-plane thermal conductivities of these composite films are found to follow the trend of the specific heat of graphene from 100 to 400 K, i.e., monotonously increasing at elevated temperatures. Such a trend can often be found within amorphous solids but has seldom been observed for nanocarbon. This unique temperature dependence of thermal conductivities is attributed to the largely restricted phonon mean free paths within the graphene sheets that mainly contribute to the in-plane thermal transport. The highest in-plane thermal conductivity among samples with different synthesis conditions is 62.8 W/(m·K) at 300 K. Such a high thermal conductivity, combined with its unique temperature dependency, can be ideal for applications such as flexible film-like thermal diodes based on the junction between two materials with a large contrast for their temperature dependence of the thermal conductivity.

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“…In general, the thermal performance of carbon materials is closely related to their structure at the nanometer scale, and phonon thermal transport [14]. In addition, some research has also focused on multiplex structural graphite materials, such as graphitized reduced graphene oxide/polyimide films (λ = 1467 W•m −1 •K −1 ) [15], graphene/carbon fiber (λ = 977 W•m −1 •K −1 ) [16], dual-functional graphene/carbon nanotube thick film (λ = 933 W•m −1 •K −1 ) [17], graphene/graphitized polydopamine/carbon nanotube all-carbon ternary composites films (λ = 1597 W•m −1 •K −1 ) [18] and so on. However, it is difficult to achieve the simplified preparation process and required thickness to ensure excellent thermal conductivity.…”

Section: Introductionmentioning

confidence: 99%

Highly Thermal Conductive Graphite Films Derived from the Graphitization of Chemically Imidized Polyimide Films

Sun

Wang

et al. 2022

Nanomaterials

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With the large-scale application and high-speed operation of electronic equipment, the thermal diffusion problem presents an increasing requirement for effective heat dissipation materials. Herein, high thermal conductive graphite films were fabricated via the graphitization of polyimide (PI) films with different amounts of chemical catalytic reagent. The results showed that chemically imidized PI (CIPI) films exhibit a higher tensile strength, thermal stability, and imidization degree than that of purely thermally imidized PI (TIPI) films. The graphite films derived from CIPI films present a more complete crystal orientation and ordered arrangement. With only 0.72% chemical catalytic reagent, the graphitized CIPI film achieved a high thermal conductivity of 1767 W·m−1·K−1, which is much higher than that of graphited TIPI film (1331 W·m−1·K−1), with an increase of 32.8%. The high thermal conductivity is attributed to the large in-plane crystallite size and high crystal integrity. It is believed that the chemical imidization method prioritizes the preparation of high-quality PI films and helps graphite films achieve an excellent performance.

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Dual-functional graphene/carbon nanotubes thick film: Bidirectional thermal dissipation and electromagnetic shielding

Cited by 74 publications

References 57 publications

Molecule bridged graphene/Ag for highly conductive ink

Molecule bridged graphene/Ag for highly conductive ink

Small-Nanostructure-Size-Limited Phonon Transport within Composite Films Made of Single-Wall Carbon Nanotubes and Reduced Graphene Oxides

Highly Thermal Conductive Graphite Films Derived from the Graphitization of Chemically Imidized Polyimide Films

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