Dry etching of copper thin films in high density plasma of CH3COOH/Ar

Ryu, Jin Su; Lim, Eun Taek; Choi, Jae Sang; Chung, Chee Won

doi:10.1016/j.tsf.2018.12.042

Cited by 17 publications

(4 citation statements)

References 19 publications

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“…Moreover, free-standing 3D structures can serve as current collectors [ 56 ] or heat sinks [ 57 ], while doping Cu or W phases into a primary metal matrix can enhance thermal properties [ 47 , 48 ]. Several additive and subtractive manufacturing methods, such as photolithography, plasma etching, wet etching, dry reactive etching, ion beam lithography, machining, physical vapor deposition, chemical vapor deposition, powder metallurgy, laser melting, and combinations of these methods have been used to fabricate these two transition metals or dope these materials into another material [ 38 , 48 , 58 , 59 , 60 , 61 , 62 , 63 , 64 , 65 ].…”

Section: Introductionmentioning

confidence: 99%

A Review on Progress, Challenges, and Prospects of Material Jetting of Copper and Tungsten

Doddapaneni,

Lee,

Aysal

et al. 2023

Nanomaterials

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Copper (Cu) and tungsten (W) possess exceptional electrical and thermal conductivity properties, making them suitable candidates for applications such as interconnects and thermal conductivity enhancements. Solution-based additive manufacturing (SBAM) offers unique advantages, including patterning capabilities, cost-effectiveness, and scalability among the various methods for manufacturing Cu and W-based films and structures. In particular, SBAM material jetting techniques, such as inkjet printing (IJP), direct ink writing (DIW), and aerosol jet printing (AJP), present a promising approach for design freedom, low material wastes, and versatility as either stand-alone printers or integrated with powder bed-based metal additive manufacturing (MAM). Thus, this review summarizes recent advancements in solution-processed Cu and W, focusing on IJP, DIW, and AJP techniques. The discussion encompasses general aspects, current status, challenges, and recent research highlights. Furthermore, this paper addresses integrating material jetting techniques with powder bed-based MAM to fabricate functional alloys and multi-material structures. Finally, the factors influencing large-scale fabrication and potential prospects in this area are explored.

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Section: Introductionmentioning

confidence: 99%

A Review on Progress, Challenges, and Prospects of Material Jetting of Copper and Tungsten

Doddapaneni,

Lee,

Aysal

et al. 2023

Nanomaterials

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“…Besides, the chemical reaction between the slurry and Cu can also lead to excessive surface corrosion problems such as disk pits or erosion pits [17], and CMP slurry can cause environmental pollution problems. Dry etching is also commonly used to etch Cu film with halogen gases such as CCl 4 , SiCl 4 , Cl 2 , and HBr [18,19]. Nevertheless, dry etching requires expensive vacuum equipment, and the emission of reaction gas also needs to be properly treated.…”

Section: Introductionmentioning

confidence: 99%

Nanoscale-Precision Removal of Copper in Integrated Circuits Based on a Hybrid Process of Plasma Oxidation and Femtosecond Laser Ablation

Wang

Zhang

et al. 2021

Micromachines

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Copper (Cu) is the main interconnect conductor for integrated circuits (IC), and its processing quality is very important to device performance. Herein, a hybrid process of plasma oxidation and femtosecond laser (fs-laser) ablation was proposed for the nanoscale precision removal of Cu in integrated circuits. In this hybrid process, the surface layer of Cu was oxidized to the copper oxide by plasma oxidation, and then the fs-laser with a laser fluence lower than the Cu ablation threshold was used to remove the copper oxide without damaging the underlying Cu. Theoretically, the surface temperature evolutions of Cu and copper oxide under the femtosecond laser were studied by the two-temperature model, and it was revealed that the ablation threshold of copper oxide is much lower than that of Cu. The experimental results showed that the ablation threshold of copper oxide is lower than that of Cu, which is consistent with the theoretical analysis. Using the hybrid process, a surface roughness of 3 nm and a removal accuracy of 4 nm were obtained in the process of Cu film processing, which were better than those obtained by fs-laser ablation. This demonstrated that the hybrid process has good application potential in the field of copper micromachining.

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“…Several approaches to fabricating Cu coatings have been developed, including plasma etching, 10 physical vapor deposition, 11 chemical vapor deposition, 6 electroless deposition, 12 and electrodeposition. 13 Among these approaches, electrodeposition has been studied for decades because it is a low-cost and easy-tooperate approach.…”

mentioning

confidence: 99%

Fabrication of Pyramid-Like Structured Cu Coatings by Pulse-Reverse Current Electrodeposition

Tang¹,

Yan²,

Han³

et al. 2022

J. Electrochem. Soc.

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Copper (Cu) coatings with a high surface area have attracted significant attention for functional devices due to their high thermal and electrical properties. Pulse-reverse current (PRC) electrodeposition has been introduced to fabricate Cu coatings for a long history, but little attention has been paid to the synergistic effects of anodic and cathodic steps instead of the individual anodic step. The new parameter “artificial exchange current density” (jA) has been demonstrated to quantify the effects of anodic and cathodic currents on the morphology in our previous work. Herein, a key metricthe relative current amplitudethat is positively correlated with jA, is used to further clarify the role of jA in the electrodeposition process. We fabricate Cu coatings with well-dispersed pyramid-like structures and find the relative current amplitude dominates the formation of a larger raised structure at the initial nucleation stage. Moreover, the anodic current can dissolve high-energy planes and achieve a high (111) texture. Afterward, screw dislocation drives the spiral growth of grains, resulting in pyramid-like structures. This study not only enriches our understanding of the artificial exchange current density in PRC electrodeposition but also guides us to achieve Cu coatings with high surface area.

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Dry etching of copper thin films in high density plasma of CH3COOH/Ar

Cited by 17 publications

References 19 publications

A Review on Progress, Challenges, and Prospects of Material Jetting of Copper and Tungsten

A Review on Progress, Challenges, and Prospects of Material Jetting of Copper and Tungsten

Nanoscale-Precision Removal of Copper in Integrated Circuits Based on a Hybrid Process of Plasma Oxidation and Femtosecond Laser Ablation

Fabrication of Pyramid-Like Structured Cu Coatings by Pulse-Reverse Current Electrodeposition

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