2011
DOI: 10.4313/teem.2011.12.2.60
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Dry Etching Characteristics of Zinc Oxide Thin Films in Cl2-Based Plasma

Abstract: We investigated the etching characteristics of zinc oxide (ZnO) and the effect of additive gases in a Cl 2 -based inductively coupled plasma. The inert gases were argon, nitrogen, and helium. The maximum etch rates were 44.3, 39.9, and 37.9 nm/min for Cl 2 (75%)/Ar(25%), Cl 2 (50%)/N 2 (50%), and Cl 2 (75%)/He(25%) gas mixtures, 600 W radiofrequency power, 150 W bias power, and 2 Pa process pressure. We obtained the maximum etch rate by a combination of chemical reaction and physical bombardment. A volatile co… Show more

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Cited by 4 publications
(3 citation statements)
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“…Dry etching of zinc oxide has been performed by using different gases as reactive species: chlorine-, bromine-, and flourine-based plasma chemical agents . However, combination of hydrogen and a hydrocarbon compound is most widely used in plasma-based reactive ion etching of zinc oxide.…”
Section: Introductionmentioning
confidence: 99%
See 1 more Smart Citation
“…Dry etching of zinc oxide has been performed by using different gases as reactive species: chlorine-, bromine-, and flourine-based plasma chemical agents . However, combination of hydrogen and a hydrocarbon compound is most widely used in plasma-based reactive ion etching of zinc oxide.…”
Section: Introductionmentioning
confidence: 99%
“…17 Additionally, reactive ion or dry etching plasma processes of ZnO have been used in the fabrication of devices 18−20 as well as modification of surface morphology. 21,22 Dry etching of zinc oxide has been performed by using different gases as reactive species: chlorine-, 23 bromine-, 24 and flourine-based plasma chemical agents. 25 However, combination of hydrogen and a hydrocarbon compound is most widely used in plasma-based reactive ion etching of zinc oxide.…”
Section: Introductionmentioning
confidence: 99%
“…One is chlorine-containing gas (such as Cl2, BCl3, CCl4, SiCl4, or CCl3F, etc.) [2] [3], the other is hydrocarbon gas. (such as C2H6/H2 or CH4/H2) [4] [5].…”
Section: Introductionmentioning
confidence: 99%