Dry cleaning for metallic contaminants removal as the second cleaning process after the CMP process

Lim, Jong Min; Jeon, Bu-yong; Lee, Chongmu

doi:10.1016/s0254-0584(00)00481-8

Cited by 8 publications

(1 citation statement)

References 10 publications

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“…Some of the previous work concerned plasma removal of metal pollutants. The cleaning mechanism of hydrogen plasma on metal impurities, namely copper (Cu), iron (Fe) and potassium (K), on a Si substrate has been revealed [21]. Cu, K and Fe impurity atoms which coexist with the chemical and/or native oxides on the Si wafer surface are eliminated together when the oxides are removed by hydrogen plasma [22].…”

Section: Introductionmentioning

confidence: 99%

Investigation of a facile plasma-driven method for in situ cleaning of metal-based contamination

Wang

Yang

Guo

et al. 2022

Plasma Sci. Technol.

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Self-cleaning of tin contaminants was realized utilizing self-driven hydrogen plasma. Cleaning rates of 0.7-6 nm min-1 were achieved to remove discontinuous tin particles at different powers. The analysis of topography and cross-sectional morphology revealed that the removal of tin particles was achieved through top-down cleaning with hydrogen plasma, where the upper part of spherical tin particles was always more intensely cleaned under the synergistic effect of hydrogen atoms and ions due to the vertical incidence of ions to substrate during the whole cleaning process. The redeposition of tin atoms caused by physical sputtering and its promotion of the chemical cleaning effect was observed for the first time. Reflectance recovery measurements during cleaning and surface analysis of the substrate after cleaning indicated that nondestructive cleaning with reflectance loss of less than 1% can be achieved at a relatively low power of 120 W. The plasma-induced substrate damage, such as holes and valleys, reduced the reflectance of the substrate when cleaning was performed at a high power ＞120 W, which should only be considered to apply in the condition without substrate exposed. This study provides a comprehensive understanding of the removal of discontinuous tin particles using the in-situ self-driven plasma cleaning method, which also provides meaningful guidance for the extension of this method in other potential application fields.

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Section: Introductionmentioning

confidence: 99%