Drop Shock Performance of SAC-Bi Compared to SnPb

Vyas, Palash Pranav; Belhadi, Mohamed El Amine; Wei, Xin; Hamasha, Ehab; Alakayleh, Abdallah; Srinivasan, Arvind; Akula, Raj Kiran; Hamasha, Sa’d; Suhling, Jeff; Lall, Pradeep

doi:10.1109/itherm54085.2022.9899679

Cited by 8 publications

(2 citation statements)

References 17 publications

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“…Kujala et al (2002b) considered the thermal and drop reliability of fine pitch BGA and LGA packages and showed that the LGA reliability is improved by four and two times over the BGAs in thermal drop reliability tests, respectively. Syed and Darveaux (2000) performed the three-point bending reliability experiments, and the results showed that the LGAs can withstand the mechanical cyclic load longer than BGA components. Gharaibeh et al (2018a) conducted a thorough experimental and medical study on the vibration reliability behavior of LGA and BGA considering lead-based and lead-free interconnects.…”

Section: Introductionmentioning

confidence: 99%

“…Besides, because of the continuous demand for thinner and more reliable devices, land grid array (LGA) interconnects are becoming an appealing and much fashionable design choice over the conventional ball grid array (BGA) solder balls (Joshi et al, 2012;Kujala et al, 2002a). Generally speaking, LGA packages are very similar to BGA systems but without mounting the solder ball which, therefore, results in significantly shorter interconnect standoff height, as shown in Figure 1, allowing for a slimmer overall design (Vyas et al, 2022;Zhang et al, 2021). Countless studies are available in literature that discussed the performance of LGA and BGA electronic package configurations under various mechanical and thermomechanical loading conditions.…”

Section: Introductionmentioning

confidence: 99%

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Drop and impact reliability investigation of BGA and LGA interconnects

Gharaibeh

Pitarresi

2023

SSMT

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Purpose Because of growing demand for slim, thin and cheap handheld devices, reduced-volume solder interconnects like land grid array (LGA) are becoming attractive and popular choices over the traditional ball grid array (BGA) packages. This study aims to investigate the mechanical shock and impact reliability of various solder alloys and BGA/LGA interconnect configurations. Design/methodology/approach Therefore, this paper uses drop testing experiments and numerical finite element simulations to evaluate and compare the reliability performance of both LGA and BGA components when exposed to drop and impact loadings. Additionally, three common solder alloys, including 63Sn37Pb, SAC305 and Innolot, are discussed. Findings The results of this study showed that electronic packages’ drop and impact reliability is strongly driven by the solder configuration and the alloy type. Particularly, the combination of stiff solder alloy and shorter joint, LGA’s assembled with SAC305, results in highly improved drop reliability. Moreover, the BGA packages’ performance can be considerably enhanced by using ductile and compliant solder alloys, that is, 63Sn37Pb. Finally, this paper discussed the failure mode of the various solder configurations and used simulation results to explain the crack and failure situations. Originality/value In literature, there is a lack of published work on the drop and impact reliability evaluation and comparison of LGA and BGA solders. This paper provides quantitative analysis on the reliability of lead-based and lead-free solders when assembled with LGA and BGA interconnects.

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Section: Introductionmentioning

confidence: 99%