Drop-on-Demand Laser Sintering With Silver Nanoparticles for Electronics Packaging

Maekawa, Katsuhiro; Yamasaki, Kazuhiko; Niizeki, Tomotake; Mita, Mamoru; Matsuba, Yorishige; Terada, Nobuto; Saitô, Hiroshi

doi:10.1109/tcpmt.2011.2178606

Cited by 56 publications

(44 citation statements)

References 10 publications

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“…9,2016 particles as small as around 10 nm in diameter. [10] Thermal damage to the substrate should be lessened, however, the furnace sintering requires a heat treatment at least 500 K for 60 min to obtain a high conductivity similar to that of the bulk material.…”

Section: E16-008-2mentioning

confidence: 99%

“…To meet with these requirements, a novel process for electrical contact forming, which combines dispensing a silver nanoparticle paste with laser sintering, has been proposed. [9] Basically, it is an ink-jet printing technology used in the printed electronics industry, having the advantages of fewer processes without the need for a substantial chemical solution, as compared to conventional photolithography, and ondemand patterning without a masking process, as compared to electroplating. In addition, the sintering temperature can be reduced to one much lower than the melting point of the bulk material because a size effect appears in …”

Section: Introductionmentioning

confidence: 99%

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Selective Laser Sintering with Gold Nanoparticles on Stainless Steel for Electrical Components

Yamaguchi¹,

Miyagi²,

Mita³

et al. 2016

Transactions of The Japan Institute of Electronics Packaging

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The present study discusses the formation of a conductive film from noble metal nanoparticles on a stainless steel substrate for use in the manufacture of electrical components, such as connectors. The proposed method consists of ondemand dispensing with nanoparticle paste followed by a brief preheating and laser sintering. The major results obtained are as follows: the laser sintering formed a gold film with a diameter of 0.8 mm and a thickness of 0.3-1.0 μm on the stainless steel substrate without any surface pretreatment; a laser with a wavelength of 915 nm enabled instantaneous sintering within one second in air; the laser-sintered gold nanoparticle film had such a high adhesion to the substrate that no separation occurred after 90°-0.5R bend-peel tests; the high adhesion was attributed to the interdiffusion of gold, iron, chromium and nickel in the course of sintering; primary sintering of the preheated gold nanoparticles at 523 K for 60 s with a small amount of solvents, and secondly sintering from the substrate side proceed simultaneously, making possible efficient sintering of the nanoparticles as well as high adhesion to the substrate; the laser-sintered gold film possessed a very good electrical property.

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Section: E16-008-2mentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Selective Laser Sintering with Gold Nanoparticles on Stainless Steel for Electrical Components

Yamaguchi¹,

Miyagi²,

Mita³

et al. 2016

Transactions of The Japan Institute of Electronics Packaging

Self Cite

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“…Although there have been lots of reports regarding the laser-sintering of AgNPs, most of previous works utilize the direct irradiation of laser onto the coated or printed AgNP-layer. The absorption of irradiated energy from laser happens inside AgNPs or the substrate below AgNPs depending on the wavelength of laser [15]. Based on the previous report, IR laser (λ = 980 nm) was selected to make sintered AgNP layer a dense structure with less pores [15].…”

Section: A Optimizing the Laser Sintering Of Agnpsmentioning

confidence: 99%

“…This letter shows that the device performance of highpower LEDs based on the AgNP adhesive can be improved significantly through the use of a laser-sintering method [15]. To assess the influence of the laser-sintering process on the device performance, three different LEDs based on AgNP as well as conventional die adhesives with a silicone base and a silver-epoxy paste were fabricated using a thermal curing method in a convection oven.…”

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confidence: 99%

Laser-Sintered Silver Nanoparticles as a Die Adhesive Layer for High-Power Light-Emitting Diodes

Lee

Yun

Kim

et al. 2014

IEEE Trans. Compon., Packag. Manufact. Technol.

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A laser-sintered die adhesive based on silver nanoparticles (AgNPs) is used to fabricate high-power lightemitting diodes (LEDs). Following the optimization of the laser power and the irradiation time, the laser sintering of AgNPs without any organic binder shows the comparable adhesion property to that of conventional LED chip bonding layer with silicone and silver-loaded epoxy adhesives. Among tested LEDs, devices using the laser-sintered AgNP adhesive exhibit the best performance in both light-emitting efficiency and reliability, which are governed by the thermal conducting property of chip bonder. Morphological analyses indicate that the elongated microstructure of AgNP-adhesive layer by laser-sintering process contributes to the performance enhancement of LEDs.

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“…Silver nanoparticles form an agglomeration of silver particles once they are printed, and each particle is surrounded by a polymer coating that helps nanoparticles keep in the form of ink. It has to be stressed that a sintering process through the use of laser, ultraviolet flash lamp, or microwave heating [40]- [42] is required to make the printed ink sufficiently conductive by burning off the polymer coating and the solvent impurities. Additionally, the sintering process melts the particles together and increases the bond of the silver trace with the substrate.…”

Section: Properties Of Ink-jet-printed Nanoparticlesmentioning

confidence: 99%

No Battery Required: Perpetual RFID-Enabled Wireless Sensors for Cognitive Intelligence Applications

et al. 2013

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No Battery RequiredO ver the last decade, radio frequency identification (RFID) systems have been increasingly used for identification and object tracking due to their low-power, low-cost wireless features. In addition, the explosive demand for ubiquitous rugged low-power, compact wireless sensors for Internet-of-Things, ambient intelligence, and biomonitoring/quality-of-life application has sparked a plethora of research efforts to integrate sensors with an RFID-enabled platform. The rapid evolution of large-area electronics printing technologies (e.g., ink-jet printing and gravure printing) has enhanced the development of low-cost RFID-enabled sensors as well as accelerated their large-scale deployment. This article presents a

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Drop-on-Demand Laser Sintering With Silver Nanoparticles for Electronics Packaging

Cited by 56 publications

References 10 publications

Selective Laser Sintering with Gold Nanoparticles on Stainless Steel for Electrical Components

Selective Laser Sintering with Gold Nanoparticles on Stainless Steel for Electrical Components

Laser-Sintered Silver Nanoparticles as a Die Adhesive Layer for High-Power Light-Emitting Diodes

No Battery Required: Perpetual RFID-Enabled Wireless Sensors for Cognitive Intelligence Applications

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