Proceedings of IEEE Sensors, 2004.
DOI: 10.1109/icsens.2004.1426198
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Drift of magnetic sensitivity of smart hall sensors due to moisture absorbed by the IC-package

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Cited by 20 publications
(11 citation statements)
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“…As sensor elements one can use horizontal Hall plates (HHall) [9,10] or MAGFETs [11]. The main advantage is the mature technology of HHalls, where the problems of offset [12] and mechanical stress [13,14] are solved. Another advantage is the differential sensing principle, which is robust against background magnetic fields.…”
Section: Introductionmentioning
confidence: 99%
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“…As sensor elements one can use horizontal Hall plates (HHall) [9,10] or MAGFETs [11]. The main advantage is the mature technology of HHalls, where the problems of offset [12] and mechanical stress [13,14] are solved. Another advantage is the differential sensing principle, which is robust against background magnetic fields.…”
Section: Introductionmentioning
confidence: 99%
“…The magnetic sensitivity of Hall plates depends on the sum of in-plane stress components ∝ (1 + P 12 (σ xx + σ yy )), with P 12 ≈ 45%/GPa [14]. The current which supplies the Hall plates is defined by resistors, which suffer from piezo-resistivity of about −24%/GPa in the case of generally used n-doped resistors [14]. Thus the Hall output signals have a sensitivity to mechanical stress of roughly 69%/GPa.…”
mentioning
confidence: 99%
“…This, over the intended temperature range, leads to thermal offset drift. The series expansion of (7) in combination with a resistor mismatch μ according to (10) leads to…”
Section: Temperature Coefficient Mismatchmentioning
confidence: 99%
“…Variations of the temperature cause a change of magnetic sensitivity via the temperature dependent mobility and Hall scattering factor [8]. Moreover, a change of the environmental conditions of packaged Hall sensors, i.e., temperature, humidity [9], [10], and cyclic loads [11] lead to a change of the package stress and consequently lead to a change of the sensitivity [5], [12]. An optimized assembly process can help to decrease the stress-related sensitivity drift of Hall sensors [13], [14].…”
mentioning
confidence: 99%
“…Yet, we believe that the dominant contribution comes from varying moisture content of the mold compound: at high ambient humidity the moisture diffuses into the mold compound thereby increasing its volume, and reducing the strong compressive stress on the die [8] which, in turn, increases the magnetic sensitivity of the Hall probe. A strong argument for this theory is the good reproducibility of this drift after subsequent drying and soaking periods [9]. Although, in principle, it seems possible to reduce this kind of moisture drift by optimized mold compounds, there is no economically viable solution in sight.…”
Section: Introductionmentioning
confidence: 99%