18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) 2011
DOI: 10.1109/ipfa.2011.5992747
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DRAM failure cases under hot-carrier injection

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Cited by 10 publications
(8 citation statements)
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“…The row hammer effect is an unintended side effect that occurs when a memory row, referred to as the hammer row, is rapidly and repeatedly accessed, causing cells in nearby rows, called victim rows, to leak charge more quickly [2,22,[24][25][26]. This charge leakage can cause the cell's logical value to change, causing what is known as a bit flip.…”
Section: The Row Hammer Effect In Drammentioning
confidence: 99%
“…The row hammer effect is an unintended side effect that occurs when a memory row, referred to as the hammer row, is rapidly and repeatedly accessed, causing cells in nearby rows, called victim rows, to leak charge more quickly [2,22,[24][25][26]. This charge leakage can cause the cell's logical value to change, causing what is known as a bit flip.…”
Section: The Row Hammer Effect In Drammentioning
confidence: 99%
“…There were five failures classified by Cisco Systems in their DRAM analyses of HCI [7]. The first type of failure occurred at the global word-line circuit, which was degraded due to a pumped voltage (Vccp).…”
Section: Hot Carrier Injectionmentioning
confidence: 99%
“…The first type of failure occurred at the global word-line circuit, which was degraded due to a pumped voltage (Vccp). This resulted in slower high transition of the word-line signal [7]. The second type of failure occurred mainly due to slower low transition of the word-line signal, which then affected the remainder of the operations.…”
Section: Hot Carrier Injectionmentioning
confidence: 99%
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“…Industrials seldom communicate on their difficulties or on the failure cases they experienced (see for instance [1,2] for rare examples of the description of field return cases due to premature wearout of a silicon device). However, the products lifetime expectation from our customers and the life expectancy of the microelectronic components embedded in these products are now so divergent that we think time has come to sound the alarm and share our concerns.…”
Section: Introductionmentioning
confidence: 99%