Journal of Alloys and Compounds
 2009
DOI: 10.1016/j.jallcom.2009.07.054
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DO22–(Cu,Ni)3Sn intermetallic compound nanolayer formed in Cu/Sn-nanolayer/Ni structures

Lilin Liu
1
,
Haiyou Huang
2
,
Ruibiao Fu
3
et al.
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Cited by 8 publications
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