Do uniform tangential interfacial stresses enhance adhesion?

Menga, Nicola; Carbone, Giuseppe; Dini, Daniele

doi:10.1016/j.jmps.2017.11.022

Cited by 45 publications

(42 citation statements)

References 60 publications

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“…consistent with Eq. (7). This confirms that energy balance plus the assumption that all slip work is dissipated as heat leads to the result that slip has no effect on adhesion.…”

Section: Energy Balance and The Slip Modelsupporting

confidence: 75%

The Interaction of Frictional Slip and Adhesion for a Stiff Sphere on a Compliant Substrate

McMeeking

Ciavarella

Cricrı̀³

et al. 2020

Journal of Applied Mechanics

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How friction affects adhesion is addressed. The problem is considered in the context of a very stiff sphere adhering to a compliant, isotropic, linear elastic substrate, and experiencing adhesion and frictional slip relative to each other. The adhesion is considered to be driven by very large attractive tractions between the sphere and the substrate that can act only at very small distances between them. As a consequence, the adhesion behavior can be represented by the Johnson-Kendall-Roberts model, and this is assumed to prevail also when frictional slip is occurring. Frictional slip is considered to be resisted by a uniform, constant shear traction at the slipping interface, a model that is considered to be valid for small asperities and for compliant elastomers in contact with stiff material. A model for the interaction of friction and adhesion, known to agree with some experimental data, is utilized. This model is due to Johnson, and its adhesionfriction interaction is assumed to stem, upon shrinkage of the contact area, from a postulated reversible energy release associated with frictional slip. This behavior is considered to arise from surface microstructures generated or eliminated by frictional slip, where these microstructures store some elastic strain energy in a reversible manner. The associated reversible energy release rate is derived from the energy exchanges that occur in the system. The Johnson model, and an asymptotic analysis of it for small amounts of frictional slip, is shown to be consistent with the reversible energy release rate that we identify.

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“…consistent with Eq. (7). This confirms that energy balance plus the assumption that all slip work is dissipated as heat leads to the result that slip has no effect on adhesion.…”

Section: Energy Balance and The Slip Modelsupporting

confidence: 75%

The Interaction of Frictional Slip and Adhesion for a Stiff Sphere on a Compliant Substrate

McMeeking

Ciavarella

Cricrı̀³

et al. 2020

Journal of Applied Mechanics

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“…To this regard, successive investigations [27,28,30,31], specifically devoted to the attachment and detachment mechanics of gecko toes, have shown that the detachment process is governed by peeling, and that a non-negligible interplay exists between the toe adhesive performance and the peeling angle of the multiple spatulae and fibrils, thus leading to both high adhesive strength and low peel adhesion. Similarly, the effect of friction on adhesion has been experimentally assessed, showing that interfacial shear stress nonlinearly affect the pull-off load and may even slightly increase the adhesive performance of thin fibrillar pads [29], as indeed predicted in a recent theory [32].…”

Section: Introductionsupporting

confidence: 55%

Tuning the periodic V-peeling behavior of elastic tapes applied to thin compliant substrates

Menga

Dini

Carbone

2020

International Journal of Mechanical Sciences

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In this paper, we investigate the periodic peeling behavior of opposing symmetric peeling fronts involving an elastic tape peeled off from a deformable substrate of finite thickness, backed onto a rigid foundation.We treat the problem by means of an energetic formulation, and we found that, depending on the values of the initial detached length l, substrate thickness h, and peeling periodicity λ, the translational invariance of the peeling process is lost and restored, as the elastic interaction between the peeling fronts is limited by the substrate thickness. Indeed, given h and λ, a critical value of the detached length can be found, which is able to prevent unstable peeling of the tape under a fixed applied load, thus resulting in enhanced adhesion strength, with respect to the classical Kendall's solution for peeling from a rigid substrate. On the other hand, given the geometrical system configuration (i.e. the detached length l) the load necessary to trigger the peeling can be minimized by conveniently tuning the ratio h/λ. This feature might be of interest for the development of innovative designs for future biomedical devices, such as Transdermal Drug Delivery Systems or wound dressing, requiring low peel adhesion for safe successive removals.

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“…To this regard, several studies have been devoted to soft elastic contacts in presence of adhesion [11,[22][23][24][25], and specifically to the detachment process [26][27][28]. Experimental observations of insects and spiders [29][30][31] and theoretical studies [32][33][34] have made clear the crucial role played by highly flexible terminal spatula-shaped substructures attached to their legs, which finally allows them to easily climb on surfaces with different properties in terms of roughness and compliance.…”

Section: Introductionmentioning

confidence: 99%

The multiple V-shaped double peeling of elastic thin films from elastic soft substrates

Menga

Afferrante

Pugno

et al. 2018

Journal of the Mechanics and Physics of Solids

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In this paper, a periodic configuration of V-shaped double peeling process is investigated. Specifically, an elastic thin film is detached from a soft elastic material by applying multiple concentrated loads periodically distributed with spatial periodicity λ. The original Kendall's idea is extended to take into account the change in elastic energy occurring in the substrate when the detachment fronts propagate. The symmetric configuration typical of a V-peeling process causes the energy release rate to be sensitive to the variations of elastic energy stored in the soft substrate. This results in an enhancement of the adhesion strength, because part of the external work required to trigger the peeling mechanism is converted in substrate elastic energy. A key role is played by both spatial periodicity λ and elasticity ratio E/E h , between tape and substrate elastic moduli, in determining the conditions of stable adhesion. Indeed, the presence of multiple peeling fronts determines a modification of the mechanism of interaction, because deformations close to each peeling front are also affected by the stresses related to the other fronts. Results show that the energy release rate depends on the detached length of the tape so that conditions can be established which lead to an increase of the supported load compared to the classical peeling on rigid substrates. Finally, we also find that for any given value of the load per unit length, an optimum value of the wavelength λ exists that maximizes the tolerance of the system, before unstable propagation of the peeling front can occur.

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Do uniform tangential interfacial stresses enhance adhesion?

Cited by 45 publications

References 60 publications

The Interaction of Frictional Slip and Adhesion for a Stiff Sphere on a Compliant Substrate

The Interaction of Frictional Slip and Adhesion for a Stiff Sphere on a Compliant Substrate

Tuning the periodic V-peeling behavior of elastic tapes applied to thin compliant substrates

The multiple V-shaped double peeling of elastic thin films from elastic soft substrates

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