DIVAS: fully automated simulation based mask defect dispositioning and defect management system

Munir, Saghir; Bald, Daniel J.; Tolani, Vikram; Ghadiali, Firoz; Lieberman, Barry

doi:10.1117/12.569096

Cited by 3 publications

(3 citation statements)

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“…Additionally, SEM image quality is more reliable at final chrome versus resist, so the plates were processed through etch and clean and then measured. In-house software was used to analyze the image and to extract contour information 13 . These contours were overlaid with design data and we extracted the deviation of the contour relative to design.…”

Section: Nd Level Fidelitymentioning

confidence: 99%

Second level exposure for phase shift mask applications using an SLM-based DUV mask writer

et al. 2005

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Phase shift mask (PSM) applications are becoming essential for addressing the lithography requirements of the 65 nm technology node and beyond. Many mask writer properties must be under control to expose the second level of advanced PSM: second level alignment system accuracy, resolution, pattern fidelity, critical dimension (CD) uniformity and registration. Optical mask writers have the advantage of process simplicity for this application, as they do not require a discharge layer. This paper discusses how the mask writer properties affect the error budget for printing the second level. A deep ultraviolet (DUV) mask writer with a spatial light modulator (SLM) is used in the experimental part of the paper. Partially coherent imaging optics at the 248 nm wavelength provide improved resolution over previous systems, and pattern fidelity is optimized by a real-time corner enhancement function. Lithographic performance is compared to the requirements for second level exposure of advanced PSM. The results indicate sufficient capability and stability for 2 nd level alternating PSM patterning at the 65 nm and 45 nm nodes.

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Section: Nd Level Fidelitymentioning

confidence: 99%

Second level exposure for phase shift mask applications using an SLM-based DUV mask writer

et al. 2005

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“…There is also a problem of developing such a system in house, as this would require a dedicated staff for maintenance and enhancements [1,2,3]. Of course, their may be cases where this is the only viable option, such as when tight integration with existing factory process control software is required.…”

Section: Introductionmentioning

confidence: 96%

RS-Mini: an enterprise class highly compact mask inspection defect management framework for the mask and wafer fab infrastructure

Munir¹

2011

SPIE Proceedings

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Information is 'key'. Timely information in a fab environment provides substantial insight into the Mask quality, process health, steps needed to improve yield and throughout time. Ideal for mask and wafer fabs, the RS-Mini central server brings the inspection tool's terminal to the end user via a desktop application. Hundreds of users can simultaneously classify (with automation capability), annotate repair history, query and summarize year's worth of inspection results with images from tens of tools, as well as establish defect and process health trends in a matter of seconds. The RS-Mini, a low cost, state of the art mask defect management framework delivering a highly integrated rich user experience, fits in a compact rack mountable server blade less than 2 inches in thickness.

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“…Shown on left in figure 1, is a 512x512 SEM image of two neighboring gates. The intensity profile along the horizontal axis from a single * saghir.munir@intel.com 1 Tebaldi is a module of the DIVAS (Defect Inspection Viewing Archiving and Simulation) suite of applications [1][2] [3], all developed at Intel. The system uses computer simulation to predict the impact of imperfections found on masks, and can automatically disposition defects with no user intervention.…”

Section: Introductionmentioning

confidence: 99%

Image-based metrology software for analysis of features on masks and wafers

et al. 2004

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Tebaldi 1 is a software tool developed at Intel Mask Operation (IMO) for quantitatively analyzing patterns in 2D. Its initial scope was to analyze aerial images taken with a microscope. However the software has recently been enhanced to support aerial images obtained through simulation, bitmap, jpeg and tiff files saved from the mask inspection systems and the scanning electron microscope (SEM). This article primarily focuses on the SEM module of the software. Tebaldi supports simulated aerial images generated through IMO's simulation based defect disposition system. This allows engineers to directly correlate 2D structures in an experimental aerial image, with those in a simulated image. To analyze SEM images, the software features scaling, alignment and calibration functions. Several linear and non-linear filtration techniques to reduce noise and charging exist. Custom convolution kernels can be user defined. Ability to segment features and extract contours also exist. Further, these contours can be overlayed and shortest distances between corresponding points can be computed in a user friendly manner with a high degree of confidence. Tebaldi is currently used in production to disposition defects in repaired sites on masks shipped from IMO as well as to compare SEM images to determine the pattern fidelity across mask writers and processes within IMO.

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DIVAS: fully automated simulation based mask defect dispositioning and defect management system

Cited by 3 publications

References 0 publications

Second level exposure for phase shift mask applications using an SLM-based DUV mask writer

Second level exposure for phase shift mask applications using an SLM-based DUV mask writer

RS-Mini: an enterprise class highly compact mask inspection defect management framework for the mask and wafer fab infrastructure

Image-based metrology software for analysis of features on masks and wafers

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