Distributed Microscale Brain Implants with Wireless Power Transfer and Mbps Bi-directional Networked Communications

Leung, Vincent; Cui, Lingxiao; Alluri, Sravya; Huang, Jiannan; Mok, Ethan; Shellhammer, Stephen J.; Rao, Ramesh R.; Asbeck, P.M.; Mercier, Patrick P.; Larson, L.E.; Nurmikko, A. V.; Laiwalla, Farah

doi:10.1109/cicc.2019.8780289

Cited by 20 publications

(7 citation statements)

References 6 publications

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“…A study of this application was conducted in Li et al, 50 Wang et al, 66 and Zeng et al 69 as a practical means of deploying a large number of wireless powered sensor nodes into even the most difficult harsh terrains and inaccessible areas. A comprehensive study on the opportunities and challenges of wireless communications with UAVs is given in Zeng et al 69 Some key limitations of UAVassisted MPT technique are presented in Li et al 50 and include that EH and data transmission operations can be hampered by the movements of the UAV and that 45 Li et al, 50 Duan et al, 53 Lin et al, 54 Dai et al, 55 Yang et al, 56 Li et al, 57 and Moraes et al 58 Omnidirectional WPT Hong et al, 4 Choi et al, 35 Mai et al, 37 Che et al, 59 Wang et al, 60 and Dai et al 61 Bidirectional WPT Ding et al, 62 Leung et al, 63 Ota et al, 64 and Liao and Lin 65 WPT: wireless power transfer.…”

Section: Applications Of Wpt and Eh In Dsnsmentioning

confidence: 99%

Wireless power transfer and energy harvesting in distributed sensor networks: Survey, opportunities, and challenges

Ijemaru

Ang

Seng

2022

International Journal of Distributed Sensor Networks

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Distributed sensor networks have emerged as part of the advancements in sensing and wireless technologies and currently support several applications, including continuous environmental monitoring, surveillance, tracking, and so on which are running in wireless sensor network environments, and large-scale wireless sensor network multimedia applications that require large amounts of data transmission to an access point. However, these applications are often hampered because sensor nodes are energy-constrained, low-powered, with limited operational lifetime and low processing and limited power-storage capabilities. Current research shows that sensors deployed for distributed sensor network applications are low-power and low-cost devices characterized with multifunctional abilities. This contributes to their quick battery drainage, if they are to operate for long time durations. Owing to the associated cost implications and mode of deployments of the sensor nodes, battery recharging/replacements have significant disadvantages. Energy harvesting and wireless power transfer have therefore become very critical for applications running for longer time durations. This survey focuses on presenting a comprehensive review of the current literature on several wireless power transfer and energy harvesting technologies and highlights their opportunities and challenges in distributed sensor networks. This review highlights updated studies which are specific to wireless power transfer and energy harvesting technologies, including their opportunities, potential applications, limitations and challenges, classifications and comparisons. The final section presents some practical considerations and real-time implementation of a radio frequency–based energy harvesting wireless power transfer technique using Powercast™ power harvesters, and performance analysis of the two radio frequency–based power harvesters is discussed. Experimental results show both short-range and long-range applications of the two radio frequency–based energy harvesters with high power transfer efficiency.

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Section: Applications Of Wpt and Eh In Dsnsmentioning

confidence: 99%

Wireless power transfer and energy harvesting in distributed sensor networks: Survey, opportunities, and challenges

Ijemaru

Ang

Seng

2022

International Journal of Distributed Sensor Networks

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“…As the vehicle to develop and test the programmable co‐design ideas for post‐process editing of CMOS microchips for wearable/implantable biomedical applications ( Figure 1 a ), we leveraged our previous work on sub‐mm size low‐power ASICs for wireless neural interfaces. [ 15 , 32 , 33 , 34 ] The chip platform (here using the TSMC 65 nm RF process node) incorporates sensor or stimulator mixed‐signal front‐ends that interface with biological tissue, and digital state machines for data processing as well as programming current stimulation of target tissue. For wireless communication, the silicon die also includes an on‐chip RF coil, rectifier, and modulator for both RF signals and energy harvesting (Figure 1b ).…”

Section: Resultsmentioning

confidence: 99%

“…Procedure for Designing and Testing Wireless Microchips: The wireless microchips which were co-designed to house fuse and anti-fuse structures were programmed by building upon the previous studies [15,[32][33][34] in utilizing the TSMC 65 nm mixed-signal/RF low-power CMOS foundry process. All the microchips featured a modified three-stage cross-coupled rectifier in the energy harvesting block, but only the EEG recording chips and the data communication prototype chip included an LDO regulator.…”

Section: Methodsmentioning

confidence: 99%

Versatile On‐Chip Programming of Circuit Hardware for Wearable and Implantable Biomedical Microdevices

Lee,

Leung

et al. 2023

Advanced Science

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Wearable and implantable microscale electronic sensors have been developed for a range of biomedical applications. The sensors, typically millimeter size silicon microchips, are sought for multiple sensing functions but are severely constrained by size and power. To address these challenges, a hardware programmable application‐specific integrated circuit design is proposed and post‐process methodology is exemplified by the design of battery‐less wireless microchips. Specifically, both mixed‐signal and radio frequency circuits are designed by incorporating metal fuses and anti‐fuses on the top metal layer to enable programmability of any number of features in hardware of the system‐on‐chip (SoC) designs. This is accomplished in post‐foundry editing by combining laser ablation and focused ion beam processing. The programmability provided by the technique can significantly accelerate the SoC chip development process by enabling the exploration of multiple internal circuit parameters without the requirement of additional programming pads or extra power consumption. As examples, experimental results are described for sub‐millimeter size complementary metal‐oxide‐semiconductor microchips being developed for wireless electroencephalogram sensors and as implantable microstimulators for neural interfaces. The editing technique can be broadly applicable for miniaturized biomedical wearables and implants, opening up new possibilities for their expedited development and adoption in the field of smart healthcare.

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“…The active microchips were designed for eventual use as distributed implants, codenamed "neurograins" in our laboratory [12,13,[35][36][37][38][39]. After the post-processing steps, the recording performance of the neurograin chips with on-chip Au planar microelectrodes was first demonstrated in a saline immersion benchtop test under RF wireless powering [13].…”

Section: Assessing the Functionality Of Post-processed Microchipsmentioning

confidence: 99%

A Scalable and Low Stress Post-CMOS Processing Technique for Implantable Microsensors

et al. 2020

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Implantable active electronic microchips are being developed as multinode in-body sensors and actuators. There is a need to develop high throughput microfabrication techniques applicable to complementary metal–oxide–semiconductor (CMOS)-based silicon electronics in order to process bare dies from a foundry to physiologically compatible implant ensembles. Post-processing of a miniature CMOS chip by usual methods is challenging as the typically sub-mm size small dies are hard to handle and not readily compatible with the standard microfabrication, e.g., photolithography. Here, we present a soft material-based, low chemical and mechanical stress, scalable microchip post-CMOS processing method that enables photolithography and electron-beam deposition on hundreds of micrometers scale dies. The technique builds on the use of a polydimethylsiloxane (PDMS) carrier substrate, in which the CMOS chips were embedded and precisely aligned, thereby enabling batch post-processing without complication from additional micromachining or chip treatments. We have demonstrated our technique with 650 μm × 650 μm and 280 μm × 280 μm chips, designed for electrophysiological neural recording and microstimulation implants by monolithic integration of patterned gold and PEDOT:PSS electrodes on the chips and assessed their electrical properties. The functionality of the post-processed chips was verified in saline, and ex vivo experiments using wireless power and data link, to demonstrate the recording and stimulation performance of the microscale electrode interfaces.

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Distributed Microscale Brain Implants with Wireless Power Transfer and Mbps Bi-directional Networked Communications

Cited by 20 publications

References 6 publications

Wireless power transfer and energy harvesting in distributed sensor networks: Survey, opportunities, and challenges

Wireless power transfer and energy harvesting in distributed sensor networks: Survey, opportunities, and challenges

Versatile On‐Chip Programming of Circuit Hardware for Wearable and Implantable Biomedical Microdevices

A Scalable and Low Stress Post-CMOS Processing Technique for Implantable Microsensors

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