Dissolution and isothermal solidification behaviour of commercially pure titanium brazed using a pure nickel filler under TLPB conditions

Tadgell, Colin A.; Corbin, Stephen F.

doi:10.1007/s10853-020-05687-z

Cited by 5 publications

(1 citation statement)

References 22 publications

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“…The functional thin films are formed in the order of an insulating (dielectric), adhesion, and seed layer. According to previous studies, the SiO 2 /Ti/Cu structure is most commonly used as functional thin films [2,86,87]. Table 1 summarizes recent studies of functional thin films in TSV.…”

Section: Functional Layersmentioning

confidence: 99%

Advanced 3D Through-Si-Via and Solder Bumping Technology: A Review

Jang,

Sharma,

Jung

2023

Materials

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Three-dimensional (3D) packaging using through-Si-via (TSV) is a key technique for achieving high-density integration, high-speed connectivity, and for downsizing of electronic devices. This paper describes recent developments in TSV fabrication and bonding methods in advanced 3D electronic packaging. In particular, the authors have overviewed the recent progress in the fabrication of TSV, various etching and functional layers, and conductive filling of TSVs, as well as bonding materials such as low-temperature nano-modified solders, transient liquid phase (TLP) bonding, Cu pillars, composite hybrids, and bump-free bonding, as well as the role of emerging high entropy alloy (HEA) solders in 3D microelectronic packaging. This paper serves as a guideline enumerating the current developments in 3D packaging that allow Si semiconductors to deliver improved performance and power efficiency.

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Section: Functional Layersmentioning

confidence: 99%