Dislocation plasticity of Al film on polyimide investigated by cross-sectional in situ transmission electron microscopy straining

Oh, Sang Ho; Rentenberger, Christian; Im, Jiseong; Kiener, Daniel; Karnthaler, H. P.; Dehm, Gerhard

doi:10.1016/j.scriptamat.2011.06.001

Cited by 12 publications

(4 citation statements)

References 19 publications

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“…During sputter deposition of the first Al layer, a homogeneous interlayer (thickness % 5 nm) is formed between PI and Al (Figure 2). Such interlayers have been previously reported in the literature for evaporated Ti and Al thin films [51][52][53] on polyimide and polymer layers spin-coated onto Al, [54] and are associated with high interfacial quality (good adhesion). However, the influence of the deposition method on metalpolymer interface structure is widely unknown.…”

Section: Interface Structure-adhesionsupporting

confidence: 66%

Electromechanical Behavior of Al/Al₂O₃Multilayers on Flexible Substrates: Insights from In Situ Film Stress and Resistance Measurements

et al. 2022

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In recent years, nanoscale metal/ceramic multilayers have come into greater focus as they exhibit promising mechanical, physical, and chemical properties, useful for a wide range of thermal, mechanical, and environmental conditions. Main efforts include manufacturing and characterization [1][2][3][4][5][6] of such structures as well as different experimental [4,5,[7][8][9][10][11][12][13][14][15] and modeling [9,13,[16][17][18][19] approaches to understand their deformation mechanisms and optimize mechanical properties. Enhancement in both, multilayer hardness and ductility, is achieved compared to rule of mixture values, depending on the bilayer thickness, the thickness ratio between ceramic and metal layers, and interfacial properties. [9,13] For thin layers (>10 nm) the metal can undergo elasticplastic deformation while the ceramic layer deforms elastically until it fails due to cracking; [4] alternatively, highly localized shear deformation may occur as a result of localized stresses at the interfaces. [5,9,15,17,19] When the layer thickness is reduced to a few nanometers, ultra-thin ceramics can plastically co-deform with metal layers, as has been demonstrated for Al/TiN. [4,18] Substantial intrinsic ductility at small scales has also been demonstrated for amorphous oxides (40 nm Al 2 O 3 ) [20] provided that the material is dense and free of geometrical flaws, whereby mechanical characterization remains experimentally challenging.Metal/ceramic multilayers are of interest for flexible thin-film applications, providing a unique combination of high strength, good conductivity, and potential damage tolerance due to sublayer fragmentation and crack deflection at interfaces.

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Section: Interface Structure-adhesionsupporting

confidence: 66%

Electromechanical Behavior of Al/Al₂O₃Multilayers on Flexible Substrates: Insights from In Situ Film Stress and Resistance Measurements

et al. 2022

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“…Studies focusing on interface formation found that chemical reactions between metal atoms and functional groups of certain substrates can form complexes and cause the formation of a thin interlayer between the metal and the polymer. In the case of the Al‐PI system studied in this work, the presence of such an Al‐O‐C interlayer has been shown (amorphous microstructure, thickness 3.6 nm) and was attributed to good interfacial adhesion …”

Section: Introductionmentioning

confidence: 70%

Interfacial mutations in the Al‐polyimide system

Pütz

Milassin

Butenko

et al. 2018

Surface & Interface Analysis

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Understanding the thermal stability of metal-polymer interfaces is essential for the reliability of innovative high-tech devices, including flexible electronics or satellite insulation. In this study, the interfacial stability of aluminum-polyimide (Al-PI) is investigated as a function of thermal cycling (±150°C) and thermal annealing treatments (150°C-300°C) with X-ray photoelectron spectroscopy measurements performed after peeling and cross-sectional transmission electron microscopy analysis. Small mutations in the interface chemistry and structure were detected and identified after annealing at 225°C for 140 hours, including the thickness increase of an amorphous interlayer between Al and PI of about 2 nm and a change in the failure mechanism during the peeling. Being able to trace subcritical mutations before they become fatal is essential to predict the reliability and lifetime of metal-polymer composites.

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“…Moreover, any outside layer could hinder dislocations from escaping at the sample surface, leading to the formation of a pile-up as recently reported for example for polyimide on an Al film. 79 In our case, the detachment of the contamination film indicates no strong binding to the Cu pillar 80 and should therefore be of minor concern.…”

Section: Surface Pillar Compressionmentioning

confidence: 60%

Application of small-scale testing for investigation of ion-beam-irradiated materials

et al. 2012

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Dislocation plasticity of Al film on polyimide investigated by cross-sectional in situ transmission electron microscopy straining

Cited by 12 publications

References 19 publications

Electromechanical Behavior of Al/Al₂O₃Multilayers on Flexible Substrates: Insights from In Situ Film Stress and Resistance Measurements

Electromechanical Behavior of Al/Al₂O₃Multilayers on Flexible Substrates: Insights from In Situ Film Stress and Resistance Measurements

Interfacial mutations in the Al‐polyimide system

Application of small-scale testing for investigation of ion-beam-irradiated materials

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Dislocation plasticity of Al film on polyimide investigated by cross-sectional in situ transmission electron microscopy straining

Cited by 12 publications

References 19 publications

Electromechanical Behavior of Al/Al2O3Multilayers on Flexible Substrates: Insights from In Situ Film Stress and Resistance Measurements

Electromechanical Behavior of Al/Al2O3Multilayers on Flexible Substrates: Insights from In Situ Film Stress and Resistance Measurements

Interfacial mutations in the Al‐polyimide system

Application of small-scale testing for investigation of ion-beam-irradiated materials

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Electromechanical Behavior of Al/Al₂O₃Multilayers on Flexible Substrates: Insights from In Situ Film Stress and Resistance Measurements

Electromechanical Behavior of Al/Al₂O₃Multilayers on Flexible Substrates: Insights from In Situ Film Stress and Resistance Measurements