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The present study investigates aerosol transport and surface deposition in a realistic classroom environment using computational fluid-particle dynamics simulations. Effects of particle size, aerosol source location, glass barriers, and windows are explored. While aerosol transport in air exhibits some stochasticity, it is found that a significant fraction (24%–50%) of particles smaller than 15 µ m exit the system within 15 min through the air conditioning system. Particles larger than 20 µ m almost entirely deposit on the ground, desks, and nearby surfaces in the room. Source location strongly influences the trajectory and deposition distribution of the exhaled aerosol particles and affects the effectiveness of mitigation measures such as glass barriers. Glass barriers are found to reduce the aerosol transmission of 1 µ m particles from the source individual to others separated by at least 2.4 m by ∼92%. By opening windows, the particle exit fraction can be increased by ∼38% compared to the case with closed windows and reduces aerosol deposition on people in the room. On average, ∼69% of 1 µ m particles exit the system when the windows are open.

High resolution transmission electron microscopy of nanotwinned Cu films revealed Σ3 {112} incoherent twin boundaries (ITBs), with a repeatable pattern involving units of three {111} atomic planes. Topological analysis shows that Σ3 {112} ITBs adopt two types of atomic structure with differing arrangements of Shockley partial dislocations. Atomistic simulations were performed for Cu and Al. These studies revealed the structure of the two types of ITBs, the formation mechanism and stability of the associated 9R phase, and the influence of stacking fault energies on them. The results suggest that Σ3 {112} ITBs may migrate through the collective glide of partial dislocations.

We have investigated the thermal stability of sputter-deposited Cu thin films with a high density of nanoscale growth twins by using high-vacuum annealing up to 800 °C for 1 h. Average twin lamella thickness gradually increased from approximately 4 nm for as-deposited films to slightly less than 20 nm after annealing at 800 °C. The average columnar grain size, on the other hand, rapidly increased from approximately 50 to 500 nm. In spite of an order of magnitude increase in grain size, the annealed films retained a high hardness of 2.2 GPa, reduced from 3.5 GPa in the as-deposited state. The high hardness of the annealed films is interpreted in terms of the thermally stable nanotwinned structures. This study shows that nanostructures with a layered arrangement of low-angle coherent twin boundaries may exhibit better thermal stability than monolithic nanocrystals with high-angle grain boundaries.

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We report on the synthesis of epitaxial (single-crystal-like), nanotwinned Cu films via magnetron sputtering. Increasing the deposition rate from 1 to 4 nm/s decreased the average twin lamellae spacing from 16 to 7 nm. These epitaxial nanotwinned Cu films exhibit significantly higher ratio of hardness to room temperature electrical resistivity than columnar grain (nanocrystalline), textured, nanotwinned Cu films.

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