2005
DOI: 10.1016/j.jcrysgro.2005.02.016
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Directional growth in metal-induced lateral crystallization of amorphous Si under extremely high electric field

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Cited by 12 publications
(7 citation statements)
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“…DC electromigration in thin metallic connections is also well documented into the literature (see [17,[21][22][23][103][104][105][106][107][108]). A few metals (namely aluminum, copper, and in a lesser extent gold) have been extensively studied.…”
Section: Electromigration In Electronic Circuitsmentioning
confidence: 95%
“…DC electromigration in thin metallic connections is also well documented into the literature (see [17,[21][22][23][103][104][105][106][107][108]). A few metals (namely aluminum, copper, and in a lesser extent gold) have been extensively studied.…”
Section: Electromigration In Electronic Circuitsmentioning
confidence: 95%
“…The hole mobility evaluated from the I D -V G character- istics is $100 cm 2 V À1 s À1 , which is of the same order as that obtained using GOI substrates. 10) These results clearly show that Schottky S/D poly-Ge TFTs are useful for the realization of system-in-displays.…”
Section: Characterization Of Nige Schottky S/d Tftsmentioning
confidence: 73%
“…[1][2][3][4][5] To develop such a materials revolution in the TFT field, we have been investigating solid-phase crystallization (SPC) techniques for polycrystalline SiGe (poly-SiGe) on insulating substrates. [6][7][8][9][10] In particular, Ge is the most promising candidate for the channel materials of TFTs, because the carrier mobility of Ge is very high, and the solid-phase crystallization (SPC) temperature of amorphous Ge (a-Ge) is lower than the softening temperature of glass substrates ($550 C). 6,11,12) However, with increasing carrier velocity, floating body effects, such as those observed in silicon-on-insulator (SOI) devices, can deteriorate the performance of TFTs.…”
Section: Introductionmentioning
confidence: 99%
“…In order to achieve plane growth of a-Si 1-x Ge x with high Ge fractions, we examined the application of electric fields during Ni-MILC (20,21). In this experiment, the patterned Ni films deposited on a-SiGe, schematically shown in Fig.10(a), were employed as the electrodes.…”
Section: Uniform Growth Of Sige By Electric-field Controlled Milcmentioning
confidence: 99%