Abstract:Directed vapor deposition (DVD) is a recently developed electron beam-based evaporation technology designed to enhance the creation of high performance thick and thin film coatings on small area surfaces (generally 100 cm 2 or less). DVD technology development has been driven by a desire to combine four processing capabilities into one industrially appealing system. These capabilities are: 1) very high rate deposition (5 µm/min and higher over a 100 cm 2 area), 2) very high material utilization efficiencies (o… Show more
“…There are different methods used to increase the target's temperature during evaporation, such as resistive heating, electron and laser beam heating, arc and electrical induction heating [2,5].…”
“…(1) In the gas phase and vapour cloud due to electron collisions with vapour atoms, (2) In the evaporant material because of backscattering electrons, (3) At the surface of evaporant by converting into radiation energy, (4) By heat transfer through conduction into the crucible containing the evaporant target and (5) Collision of a fraction of electron beam with different parts of the electron beam gun [5].…”
Electron beam physical vapour deposition is a reliable technique used to deposit coatings with desired microstructures; however, controlling the chemical composition of the alloy coatings is not simple and several features should be considered. The aim of this paper is to summarise and establish the connection between the important work that has been done in this area to achieve a homogeneous and controlled chemical composition in the deposited film. Technical and fundamental aspects are discussed.
“…There are different methods used to increase the target's temperature during evaporation, such as resistive heating, electron and laser beam heating, arc and electrical induction heating [2,5].…”
“…(1) In the gas phase and vapour cloud due to electron collisions with vapour atoms, (2) In the evaporant material because of backscattering electrons, (3) At the surface of evaporant by converting into radiation energy, (4) By heat transfer through conduction into the crucible containing the evaporant target and (5) Collision of a fraction of electron beam with different parts of the electron beam gun [5].…”
Electron beam physical vapour deposition is a reliable technique used to deposit coatings with desired microstructures; however, controlling the chemical composition of the alloy coatings is not simple and several features should be considered. The aim of this paper is to summarise and establish the connection between the important work that has been done in this area to achieve a homogeneous and controlled chemical composition in the deposited film. Technical and fundamental aspects are discussed.
“…It was initially developed at the University of Virginia and is licensed to DVTI, Inc. 7 . It provides the technical basis for a flexible, high quality coating process capable of atomistically depositing dense, compositionally controlled coatings onto line-of-sight and non line-of-sight (NLOS) regions of high strength fastener components.…”
“…27 Thornton empirically showed that these conditions result in porous columnar-structured films. 30,35 Hollow cathode discharges have higher electron densities ͑in the ϳ10 12 cm −3 range͒ than those of a rf discharge ͑in the ϳ10 10 cm −3 range͒. [32][33][34] Morgner and co-workers have proposed a HAD process, which can be combined with high rate thermal evaporation DVD approach to enable the reactive synthesis of conductive and dielectric films with reduced intercolumnar porosity.…”
“…[32][33][34] Morgner and co-workers have proposed a HAD process, which can be combined with high rate thermal evaporation DVD approach to enable the reactive synthesis of conductive and dielectric films with reduced intercolumnar porosity. 30,[35][36][37][38][39] The low-voltage electrons have a high inelastic scattering cross section during collisions with argon and efficiently create an argon plasma. 30 The electron energy distribution function is composed of a Maxwell distribution of isotropically scattered electrons and a superimposed directed electron distribution-the so called low-voltage electron beam ͑LVEB͒ whose energy is in the 3 -15 eV range.…”
Lithium phosphorus oxynitride solid-state thin-film electrolyte deposited and modified by bias sputtering and low temperature annealing J. Vac. Sci. Technol. A 28, 568 (2010); 10.1116/1.3435330Influence of the normalized ion flux on the constitution of alumina films deposited by plasma-assisted chemical vapor deposition Synthesis of a material for semiconductor applications: Boron oxynitride prepared by low frequency rf plasmaassisted metalorganic chemical vapor deposition Electron emission characteristics of boron nitride films synthesized by plasma-assisted chemical vapor deposition J.A plasma-assisted directed vapor deposition approach has been explored for the synthesis of lithium phosphorous oxynitride ͑Lipon͒ thin films. A Li 3 PO 4 source was first evaporated using a high voltage electron beam and the resulting vapor entrained in a nitrogen-doped supersonic helium gas jet and deposited on a substrate at ambient temperature. This approach failed to incorporate significant concentrations of nitrogen in the films. A hollow cathode technique was then used to create an argon plasma that enabled partial ionization of both the Li 3 PO 4 vapor and nitrogen gas just above the substrate surface. The plasma-enhanced deposition process greatly increased the gas phase and surface reactivity of the system and facilitated the synthesis and high rate deposition of amorphous Lipon films with the N / P ratios between 0.39 and 1.49. Manipulation of the plasma-enhanced process conditions also enabled control of the pore morphology and significantly affected the ionic transport properties of these films. This enabled the synthesis of electrolyte films with lithium ion conductivities in the 10 −7 -10 −8 S / m range. They appear to be well suited for thin-film battery applications.
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