Direct Single Impinging Jet Cooling of a &lt;sc&gt;mosfet&lt;/sc&gt; Power Electronic Module

Jörg, Johannes Ferdinand; Taraborrelli, Silvano; Sarriegui, Garikoitz; Doncker, Rik W. De; Kneer, Reinhold; Rohlfs, Wilko

doi:10.1109/tpel.2017.2720963

Cited by 57 publications

(12 citation statements)

References 16 publications

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“…Direct microjet impingement cooling shows great potential in high power devices or high-performance systems [1,2]. The post-impingement dynamics of the jet, specifically the interaction between the liquid fronts on the surface engendered by the jets is a critical criterion improving the heat transfer characteristics.…”

Section: Introductionmentioning

confidence: 99%

Conjugate Heat Transfer and Fluid Flow Modeling for Liquid Microjet Impingement Cooling with Alternating Feeding and Draining Channels

Wei

Oprins

Cherman

et al. 2019

Fluids

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Liquid microjet impingement cooling has shown the potential to be the solution for heat removal from electronic devices such as very-large-scale integration (VLSI) chips. The post-impingement dynamics of the jet, specifically the interaction between the liquid fronts on the surface engendered by the jets is a critical criterion improving the heat transfer characteristics. While some seminally important experimental studies have investigated this attribute, the amount of accurate data and analysis is limited by the shortcomings of real-life experiments. In this article, numerical investigations into the fluid dynamics and heat transfer in microjet cooling systems are carried out. Specifically, this paper addresses the question regarding the necessary fidelity of the simulations. Different Reynolds-averaged Navier–Stokes (RANS) models are compared to the Large Eddy Simulations (LES) simulation and the potential fidelity of different eddy-viscosity-based closures is clearly shown. Recommendations are made regarding the RANS closures that should give the best performance. It is demonstrated that the transition Shear Stress Transport (SST) model and k - ω SST model both show excellent ability to predict the local or average Nu, and also local level pressure coefficient f with less than 5% difference in the range of 30 < Red < 4000, compared with the reference LES model. For the experimental measurements in the range of 130 < Red < 1400, the LES model, transition SST model and k - ω SST model all show less than 25% prediction error. Moreover, it is shown that the validity of the unit cell assumption for the temperature and flow distribution depends on the flow rate.

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Section: Introductionmentioning

confidence: 99%

Conjugate Heat Transfer and Fluid Flow Modeling for Liquid Microjet Impingement Cooling with Alternating Feeding and Draining Channels

Wei

Oprins

Cherman

et al. 2019

Fluids

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“…It is able to generate high flow rate of fluid with lower pump pressure and yield high local heat transfer rate. Jörg et al [81] developed a direct single impinging jet for cooling of a MOSFET power electronic module. Heat transfer rate could be as high as 12,000 W/ m 2 •K.…”

Section: Cutting-edge Power Electronic Cooling Solutionsmentioning

confidence: 99%

Thermal Management of Electrified Propulsion System for Low-Carbon Vehicles

Huang

Wang

et al. 2020

Automot. Innov.

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An overview of current thermal challenges in transport electrification is introduced in order to underpin the research developments and trends of recent thermal management techniques. Currently, explorations of intelligent thermal management and control strategies prevail among car manufacturers in the context of climate change and global warming impacts. Therefore, major cutting-edge systematic approaches in electrified powertrain are summarized in the first place. In particular, the important role of heating, ventilation and air-condition system (HVAC) is emphasised. The trends in developing efficient HVAC system for future electrified powertrain are analysed. Then electric machine efficiency is under spotlight which could be improved by introducing new thermal management techniques and strengthening the efforts of driveline integrations. The demanded integration efforts are expected to provide better value per volume, or more power output/torque per unit with smaller form factor. Driven by demands, major thermal issues of high-power density machines are raised including the comprehensive understanding of thermal path, and multiphysics challenges are addressed whilst embedding power electronic semiconductors, non-isotropic electromagnetic materials and thermal insulation materials. Last but not least, the present review has listed several typical cooling techniques such as liquid cooling jacket, impingement/spray cooling and immersion cooling that could be applied to facilitate the development of integrated electric machine, and a mechanic-electric-thermal holistic approach is suggested at early design phase. Conclusively, a brief summary of the emerging new cooling techniques is presented and the keys to a successful integration are concluded.

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“…Several high-efficiency liquid cooling strategies have been proposed for cooling of individual power devices, such as impinging coolant on the device [17], [18], as well as flowing coolant through microchannels [19]. The latter can result in state-of-the-art heat fluxes, due its large surface area and high heat transfer coefficient [20].…”

Section: Introductionmentioning

confidence: 99%

Efficient Microchannel Cooling of Multiple Power Devices With Compact Flow Distribution for High Power-Density Converters

Erp

Kampitsis

Matioli

2020

IEEE Trans. Power Electron.

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In this work, we describe a new approach for compact and energy-efficient cooling of converters where multiple miniaturized microfluidic cold-plates are attached to transistors providing local heat extraction. The high pressure drop associated with microchannels was minimized by connecting these cold-plates in parallel using a compact 3D-printed flow distribution manifold. We present the modeling, design, fabrication and experimental evaluation of this microfluidic cooling system and provide a design strategy for achieving energy-efficient cooling with minimized pumping power. An integrated cooling system is experimentally demonstrated on a 2.5 kW switched capacitor DC-DC converter, cooling down 20 GaN transistors. A thermal resistance of 0.2 K/W was measured at a flow rate of 1.2 ml/s and a pressure drop of 20 mbar, enabling the cooling of a total of 300 W of losses in the converter using several mW of pumping power, which can be realized with small micropumps. Experimental results show a 10fold increase in power density compared to conventional cooling, potentially up to 30 kW/l. This proposed cooling approach offers a new way of co-engineering the cooling and the electronics together to achieve more compact and efficient power converters.

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Direct Single Impinging Jet Cooling of a <sc>mosfet</sc> Power Electronic Module

Cited by 57 publications

References 16 publications

Conjugate Heat Transfer and Fluid Flow Modeling for Liquid Microjet Impingement Cooling with Alternating Feeding and Draining Channels

Conjugate Heat Transfer and Fluid Flow Modeling for Liquid Microjet Impingement Cooling with Alternating Feeding and Draining Channels

Thermal Management of Electrified Propulsion System for Low-Carbon Vehicles

Efficient Microchannel Cooling of Multiple Power Devices With Compact Flow Distribution for High Power-Density Converters

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