Direct Laser Interference Ink Printing Using Copper Metal–Organic Decomposition Ink for Nanofabrication

Abstract

In this study, we developed an effective and rapid process for nanoscale ink printing, direct laser interference ink printing (DLIIP), which involves the photothermal reaction of a copper-based metal–organic decomposition ink. A periodically lined copper pattern with a width of 500 nm was printed on a 240 μm-wide line at a fabrication speed of 17 mm/s under an ambient environment and without any pre- or post-processing steps. This pattern had a resistivity of 3.5 μΩ∙cm, and it was found to exhibit a low oxidation state that was twice as high as that of bulk copper. These results demonstrate the feasibility of DLIIP for nanoscale copper printing with fine electrical characteristics.

Key Aspects of the Processes of Thermal Decomposition of Complex Compounds of Copper Formate for Low-Temperature Printed Electronics

“…Typically, this modification consists in the introduction of additional protective or reducing additives that prevent the oxidation of copper. Recent works in this area are represented by two main lines of research based on the preparation of − and true − solutions of a functional material. The latter is a more promising approach to creating inks due to the absence of nanoparticles in their composition, which are free from problems associated with colloidal stability.…”

Self-reducing molecular ink for printed electronics and lithium-ion battery cathodes as conductive binder

“…21,22 Various optimization schemes such as amine ligands, solvents, and reduction sintering methods have been explored to overcome the easy oxidation problem of copper materials. [23][24][25][26][27] An optimized copper MOD ink can be used as a binder precursor instead of conventional polymer adhesives in the electronic ink slurry; this simultaneously improves the low solid content in conductive fillers and overcomes the disadvantage of organic additives, i.e. limitation of the conductivity of electronic inks.…”

Direct Laser Writing of Copper Micropatterns from Deep Eutectic Solvents Using Pulsed near-IR Radiation

“…This method allows one to produce patterns without photomasks, out of cheap, commercially available reagents [ 17 ]. The further development of this approach has led to significant expansion of the list of materials available for space-selective deposition, including Cu, Pd, Ni, Ag, Ru, Ir, and Pt [ 18 , 19 , 20 , 21 , 22 , 23 , 24 , 25 ]. The deposition process works on both semiconductor and dielectric substrates, which are widely used for photonic (including metamaterials), electronic, optoelectronic, and sensoric applications [ 26 , 27 , 28 ].…”