2005
DOI: 10.1088/0953-8984/17/22/021
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Direct high-resolution determination of vacancy-type defect profiles in ion-implanted silicon

Abstract: The depth distribution of open-volume point defects created by room temperature implantation of Cz silicon by 100 keV B + ions at a dose of 5 × 10 14 cm −2 has been determined by enhanced-resolution beam-based positron annihilation spectroscopy (PAS). By incremental controlled etching (via anodic oxidation of 50-100 nm layers) the depth resolution of the PAS is maintained at ∼50 nm by using positrons implanted at energies below 2 keV to probe each layer as it brought close to the surface by the etching process… Show more

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Cited by 6 publications
(6 citation statements)
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“…Positron annihilation is a powerful technique for evaluating vacancy-type defects in semiconductors. 11) Defects introduced into Si by conventional ion implantation have been investigated using this method, [11][12][13][14][15][16][17][18] and the results show that positrons are a powerful probe for studying point defects in the subsurface region of Si. In the present study, we have used a monoenergetic positron beam to probe vacancy-type defects in Si doped with B by plasma doping.…”
Section: Introductionmentioning
confidence: 99%
“…Positron annihilation is a powerful technique for evaluating vacancy-type defects in semiconductors. 11) Defects introduced into Si by conventional ion implantation have been investigated using this method, [11][12][13][14][15][16][17][18] and the results show that positrons are a powerful probe for studying point defects in the subsurface region of Si. In the present study, we have used a monoenergetic positron beam to probe vacancy-type defects in Si doped with B by plasma doping.…”
Section: Introductionmentioning
confidence: 99%
“…In both cases an estimate of the absolute divacancy distributions for each implant has been arrived at by (a) assuming that the final and initial vacancy depth profiles are similar, the latter being given by SRIM, and (b) by fixing the concentrations at half ion range to be those given by the formula developed by Coleman et al [13], which accounts for post-implantation defect recombination. Assumption (a) was shown to be reasonable by high-resolution VEPAS vacancy depth profiling measurements [14]. A similar procedure was followed to simulate the vacancy damage created by the lower-dose implants, and the result was so similar in depth dependence to figure 1 that it is not shown here.…”
Section: Methodsmentioning
confidence: 80%
“…If we assume saturation trapping in V 2 -like defects, an estimate of the defect concentration C (cm −3 ) in sample P L U in the first 200 nm below the surface can only be found using the following expression involving the effective diffusion length L eff [19]:…”
Section: Un-annealed Samplesmentioning
confidence: 99%