Direct, CMOS In-Line Process Flow Compatible, Sub 100 °C Cu–Cu Thermocompression Bonding Using Stress Engineering

Panigrahy, Asisa Kumar; Ghosh, Tamal; Kumar, C. Hemanth; Singh, Shiv Govind; Vanjari, Siva Rama Krishna

doi:10.1007/s13391-018-0037-y

Cited by 18 publications

(4 citation statements)

References 18 publications

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“…The gain as compared to previous structures is also higher which makes it suitable for indoor wireless communication. Many researchers have used various techniques to engineer the devices along with suitable antennas to accommodate for better performance [25][26][27][28][29][30][31][32][33][34].…”

Section: Resultsmentioning

confidence: 99%

A Beam Steering Dielectric Resonator Antenna Designed Using Rogers RO4003C Material for S-Band Applications

Kumari¹,

Rao²,

Jayakar³

et al. 2022

Advances in Materials Science and Engineering

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A pattern reconfigurable dielectric resonator antenna emitting at 3.1 GHz is presented in this study. The beam can be steered at 6 degrees, 8 degrees, 14 degrees, and 171 degrees. Three P-i-N diodes are employed in the slots of the ground plane to help steer the beam direction. By changing the state of the three diodes, five states can be obtained. The TE01δ mode is excited using a differential feed technique. Differential feed helps in increasing the gain and reducing the size of the structure. The return loss of each state is less than −25 dB. The gain of the first state is 7.65 dBi, the second and fifth state’s gain is 8.22 dBi, third and fourth state’s gain is 10.6 dBi. This Antenna is designed using Rogers RO4003C material which has low Electrical gravity, low voltage, and high oxidation resistance that makes it appropriate for RF applications. The properties required for RF microwave circuits, matching networks, and controlled impedance transmission lines are present in the RO4003C material. Annealed copper is used for designing the ground plane and feedline which provides excellent conductivity. The antenna is fabricated using the chemical etching process which employs a positive photoresist that gives a higher resolution accuracy for the designed antenna. This process of fabrication has another advantage of inculcating structures from simpler to complex.

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Section: Resultsmentioning

confidence: 99%

A Beam Steering Dielectric Resonator Antenna Designed Using Rogers RO4003C Material for S-Band Applications

Kumari¹,

Rao²,

Jayakar³

et al. 2022

Advances in Materials Science and Engineering

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“…The preparation of metal bumps on Micro-LED chips and the subsequent bonding with the driver chip CMOS are key steps in manufacturing high-resolution displays. There are currently many studies on bonding technology, such as Panigrahi et al demonstrated a novel mechanism to increase the diffusion across the bonding interface and also shows the CMOS in-line process flow compatible Sub 100 °C Cu-Cu bonding which is devoid of Cu surface treatment prior to bonding [17]. Zhao et al transferred the AlGaInP epitaxial layer onto a silicon substrate using In-Ag bonding technology and epitaxial layer stripping process [18].…”

Section: Introductionmentioning

confidence: 99%

Fabrication and bonding of In bumps on Micro-LED with 8 μm pixel pitch

Jiang,

Chen,

Zhang

et al. 2024

Eng. Res. Express

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Indium (In) is currently used to fabricate metal bumps on micro-light-emitting diode (Micro-LED) chips due to its excellent physical properties. However, as Micro-LED pixel size and pitch decrease, achieving high-quality In bumps on densely packed Micro-LED chips often presents more challenges. This paper describes the process of fabricating In bumps on micro-LEDs using thermal evaporation, highlighting an issue where In tends to grow laterally within the photoresist pattern, ultimately blocking the pattern and resulting in undersized and poorly dense In bumps on the Micro-LED chip. To address this issue, we conducted numerous experiments to study the height variation of In bumps within a range of photoresist aperture sizes (3 μm -7 μm) under two different resist thickness conditions (3.8 μm and 4.8 μm). The results showed that the resist thickness had a certain effect on the height of In bumps on the Micro-LED chip electrodes. Moreover, we found that, with the photoresist pattern size increasing under constant resist thickness conditions, the height and quality of the bumps significantly improved. Based on this finding, we rationalized the adjustment of the photoresist pattern size within a limited emission platform range to compensate for the height difference of In bumps caused by different resist thicknesses between the cathode and anode regions. Consequently, well-shaped and dense In bumps with a maximum height of up to 4.4 μm were fabricated on 8 μm pitch Micro-LED chips. Afterwards, we bonded the Micro-LED chip with indium bumps to the CMOS chip, and we found that we could successfully control the CMOS chip to drive the Micro-LED chip to display specific characters through the Flexible Printed Circuit (FPC). This work is of significant importance for the fabrication of In bumps on Micro-LED chips with pitches below 10 μm and subsequent bonding processes.

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“…The issue is whether businesses maintain ICT infrastructure, hardware, software, information system, and people and human resource readiness with their business [17][18][19][20]. Now, even large businesses, such as those in the semiconductor industry, are adopting newer technologies, such as three-dimensional IC integration employing Cu-Cu bonding [21][22][23][24][25][26][27][28], various revolutionary nanometer-level device fabrication techniques, even bio devices, and wearable antennas [29][30][31][32][33][34][35]. The framework model for the relationships among the ICT readiness dimensions, including ICT infrastructure, ICT hardware software, information system, and people and human resource, is shown in Figure 1.…”

Section: Introductionmentioning

confidence: 99%

ICT System for 14.0 Adoption: Comparative Study to Assess the Readiness in Manufacturing MSMEs

Nandhini

Palanivelu

Panigrahy³

et al. 2022

Journal of Nanomaterials

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One of India’s fastest-growing industries is the manufacturing sector centered on exports. Additionally, it has a greater impact on the economic development of India. Technology in the export-oriented manufacturing sector makes a significant contribution to the rise in productivity, which also boosts profits. The study’s major goal is to learn more about the adoption of the 14.0 ICT system by manufacturing enterprises with reference to MSMEs and to evaluate its efficacy. In order to gather information for this goal, a survey approach was used, with the dimensions of ICT infrastructure, ICT hardware, software, and information systems, as well as people and human resource factors, as the instruments. Multiple regression and descriptive statistics were used to evaluate the data on a sample size of 7 businesses from the Pondicherry region. The conclusion is that firms have a significant gap in their ICT preparedness in terms of ICT infrastructure, ICT hardware, software, and information systems, and this must be treated seriously by the businesses if technology advancement is to continue in the future.

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Direct, CMOS In-Line Process Flow Compatible, Sub 100 °C Cu–Cu Thermocompression Bonding Using Stress Engineering

Cited by 18 publications

References 18 publications

A Beam Steering Dielectric Resonator Antenna Designed Using Rogers RO4003C Material for S-Band Applications

A Beam Steering Dielectric Resonator Antenna Designed Using Rogers RO4003C Material for S-Band Applications

Fabrication and bonding of In bumps on Micro-LED with 8 μm pixel pitch

ICT System for 14.0 Adoption: Comparative Study to Assess the Readiness in Manufacturing MSMEs

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