Abstract Abstract-In -In -In -In this this this this paper, paper, paper, paper, we we we we theoretically theoretically theoretically theoretically study study study study the the the the electrical electrical electrical electrical properties properties properties properties of of of of a a a a separate separate separate separate absorption, absorption, absorption, absorption, grading, grading, grading, grading, charge,and charge,and charge,and charge,and multiplication multiplication multiplication multiplication , however, most papers just concerned about the structure parameters, such as the thickness of the multiplication layer, the doping of the charge layer [4 ,5]. After the actual device fabrication, APDs with similar structure parameters often show much difference in performance, which may be influenced by the fabrication process, such as introducing the traps.During actual fabrication, p doping of the device is formed by zinc diffusion, which will influence the multiplication layer doping concentration or the p doping layer and multiplication layer interface. In this paper, effects of the carrier lifetime, the doping concentration and traps concentration of the multiplication to the APD's performance are discussed. These theoretical results will be instructive for the device fabrication.
Ⅱ. MODEL DESCRIPTION AND NUMERICAL RESULTSThe basic structure of the separate absorption, grading, charge,and multiplication(SAGCM) InGaAs/InP APD under consideration is shown in Fig. 1. Numerically simulation of the device is performed using the software ISE-TCAD,with the carrier generation-recombination process accounting for Shockley-Read-Hall, Trap-Assisted Tunneling(TAT), Auger, Radiative,Band-to-Band Tunneling mechanisms.
(a) Doping concentrationThe multiplication layer is intrinsic in theory, but the Zn concentration of the p+InP layer is an error function distribution in the thermal diffusion process [7],which is equivalent to changing the dopant concentration of the multiplication layer,or even introducing traps to the interface between multiplication layer and p+InP layer. We change the doping concentration of multiplication layer from 1E15 cm -3 to 4E16