1982
DOI: 10.1063/1.330017
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Diffusion of oxygen in silicon

Abstract: Recently reported measurements of oxygen diffusion in silicon agree within experimental accuracy with a previous estimate D=0.23 exp(−2.561±0.005 eV/kT) cm2 s−1, determined from a direct measurement at lower temperatures of the one-jump process for interstitial oxygen from one Si-Si bond to an adjacent one. The diffusion constant is therefore known over 11 decades and results from a single microscopically identified process. There are few such model textbook examples for diffusion in solids.

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Cited by 61 publications
(10 citation statements)
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“…14,15,21 These studies proposed that an O atom jumps from one bridging site to another along a path in the ͑110͒ plane with a computed activation energy in agreement with experimentally measured values (2.53-2.56 eV). 22,23 Our recent calculation with a cluster mimicking the inside of a Si crystal is also in good agreement with these previous studies with an activation-energy barrier calculated to be 2.7 eV. 24 According to the present calculations, inward oxygen diffusion at a nonterminated Si surface has a lower activation energy than that for the inside of a Si crystal.…”
Section: Discussionsupporting
confidence: 90%
“…14,15,21 These studies proposed that an O atom jumps from one bridging site to another along a path in the ͑110͒ plane with a computed activation energy in agreement with experimentally measured values (2.53-2.56 eV). 22,23 Our recent calculation with a cluster mimicking the inside of a Si crystal is also in good agreement with these previous studies with an activation-energy barrier calculated to be 2.7 eV. 24 According to the present calculations, inward oxygen diffusion at a nonterminated Si surface has a lower activation energy than that for the inside of a Si crystal.…”
Section: Discussionsupporting
confidence: 90%
“…From the radius of the depletion zone the diffusion coefficient is estimated as 1.3 • 10 -13 cm2/s, where the time used was the 960 min du-9 ration of step 2. According to Watkins et al (18), the diffusion coefficients of oxygen in silicon at 700 ~ and 1200~ are 1.3 • 10 -14 and 4 • 10 -I~ cm2/s, respectively. This means that precipitate coalescence and dissolution took place to provide the oxygen which allowed the coalesced precipitates to grow.…”
Section: Results and Disucssionmentioning
confidence: 99%
“…The model space is a cubic lattice with the lattice spacing a = 0.01 um. The time step At is equal to a 2 /(6D) with D the diffusion coefficient for oxygen in silicon [11]. The thermal anneal is 100 hours at 750 t. The number of oxygen or solute atoms in the model space, 8000, is the volume times the initial oxygen concentration of 1.0x101 8 /cm 3 .…”
Section: Methodsmentioning
confidence: 99%