Diffusion Bonding of Stainless Steel to Copper with Tin Bronze and Gold Interlayers

Abstract

Vacuum diffusion bonding of stainless steel to copper was carried out at a temperature ranging from 830 to 950°C under an axial pressure of 3 MPa for 60 min with three kinds of interlayer metals: tin-bronze (TB) foil, Au foil, and TB-Au composite interlayer. The results showed that the grain boundary wetting was formed within the steel adjacent to the interface due to the contact melting between TB and Au when TB-Au composite interlayer was used. The grain boundary wetting could occur at a relatively low temperature of 830°C and becomes significant with the increase of temperature. The tensile strength of the joint with TB-Au was higher than that with TB or Au interlayer separately and could be 228 MPa at the joining temperature of 850°C. Furthermore, the axial compression ratio of the specimen joined at 850°C was approximately 1.2%. Therefore, a reliable and precise joining of stainless steel to copper could be realized by diffusion bonding with the TB-Au composite interlayer at a comparatively low temperature.

X-ray tomography study on porosity in electron beam welded dissimilar copper–304SS joints

“…Copper-SS joints have been produced by using various solid state or fusion welding processes. Solid state welding processes like diffusion welding, friction stir welding (FSW), and explosive welding have been extensively used [3][4][5][6][7][8]. In diffusion welding of copper-SS, the interlayer material, applied temperature, and pressure, etc.…”

“…Xiong et al [6] reported that compared to pure tin, bronze or gold, use of tin-bronze-gold composite interlayer, allowed the use of comparatively lower bonding temperature, increased grain boundary wetting and tensile strength. Imani et al [7] for FSW of copper-SS joints reported that off-setting of the pin toward copper side by 30% produced defect free welds with better tensile strength. Shanjeevi et al 2016 [8] reported that friction pressure is the most significant process parameter of FSW followed by pin rotational speed affecting the resultant microstructure and tensile properties of copper-SS joints.…”

Diffusion Bonding and Transient Liquid Phase (TLP) Bonding of Type 304 and 316 Austenitic Stainless Steel—A Review of Similar and Dissimilar Material Joints

“…This in itself is not too impressive given the data from Yilmaz [171] discussed earlier. Besides, Xiong et al [173] reached UTS of 228 MPa using TLP bonding (without pressure variation) with a 100 µm thick Tin-Bronze (Alloy QSn 6.5~0.1: wt% 6-7 Sn, ≤ 0.3 Zn, 0.1-0.25 P, ≤0.05 Fe, ≤0.02 Pb, ≤0.002 Al, balance Cu) and a 5 µm Au interlayer. Yuan et al [50] further used a Gleeble 1500 thermo-mechanical material testing system.…”

Transient Behavior Analysis for Solar Energy Storage in PCM-CFM Material Using Equivalent Heat Capacity Method as Storage Model

“…The optimum conditions observed for this work were at 850 C • to get tensile strength of 228 Mpa for Tb-Au interlayer. The microstructure of joint was examined using SEM and EDS [9]. Sabetghadam (2010) evaluated the microstructure of diffusion bonded joint between stainless steel 410 and copper using Ni as interlayer.…”