Diffusion-Bonding Mechanism of Aluminum Alloys by Transmission Electron Microscopy. (Report 1). Behavior of Oxide at Diffusion-Bonded Interface of Al-Mg-Si Series 6063 Alloy.

建二, 池内; 啓子, 小谷; 福久, 松田

doi:10.2207/qjjws.14.122

Search citation statements

Order By: Relevance

Paper Sections

Select...

Mechanical Behavior Of Materials X1

Citation Types

Supporting

Mentioning

Contrasting

Year Published

2002

2009

Publication Types

Select...

Article6

Relationship

Self Cite0

Independent6

Authors

Journals

Cited by 9 publications

(1 citation statement)

References 3 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Relative relation for hardness of each surface during the rising of temperature obtains the change of morphology of bonding surface by heating rate. The complex oxide film with Al and Mg could not be observed clearly as diffusion bonding in vacuum [8]. From the result of EPMA map analysis by 1K/s, Mg seems to disappear around bonding surface.…”

Section: Mechanical Behavior Of Materials Xmentioning

confidence: 87%

Effect of Heating Rate on Al Bonding in Air by Inserted A5056 Disk

Kawakami

Kimura

Kondo

et al. 2007

KEM

View full text Add to dashboard Cite

Al bonding in air by inserted A5056 was investigated in this study. Heating rate in thermal history of bonding process may have the relation with the growth of Al oxide film and the deformation of bonding surface by softening. Both of phenomena affect the joinability and the mechanical properties of bond. Al bonding in air was carried out by several heating rate. Growth of Al oxide film significantly suppressed the progress of bonding in air by low heating rate, 1K/s. Decrease of deformation of bonding surface suppressed also the progress of bonding by high heating rate, 10K/s. In case of medium heating rate, 5K/s, good joinabilty of Al bonding in air was obtained by the medium growth of oxide film and the deformation of bonding surface.

show abstract

Section: Mechanical Behavior Of Materials Xmentioning

confidence: 87%