2008
DOI: 10.1002/pssb.200879582
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Dielectrophoretically assembled carbon nanotube‐metal hybrid structures with reduced contact resistance

Abstract: We report the bottom‐up assembly of single‐walled carbon nanotube interconnects between micro‐fabricated gold electrodes by dielectrophoresis followed by a post‐dielectrophoretic deposition of metal from an aqueous Pd salt solution. The dielectrophoretic metal deposition along interconnects takes preferentially place at sites where high contact resistances occur. These create sufficiently high voltage drops, and thus, large field gradients which lead to a local deposition of met al. Since in turn the metal dep… Show more

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Cited by 14 publications
(14 citation statements)
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“…Furthermore, since the dielectrophoresis depends on dimensions of the particles, it can be applied to disperse large bundles of CNTs within the suspension 31. Dielectrophoretically located CNTs were also reported for facilitating the post‐dielectrophoretic (DEP) deposition of metals from an aqueous Pd salt solution to decrease the local resistance at the CNT‐CNT and CNT‐microelectrode joints 32.…”
Section: Introductionmentioning
confidence: 99%
See 1 more Smart Citation
“…Furthermore, since the dielectrophoresis depends on dimensions of the particles, it can be applied to disperse large bundles of CNTs within the suspension 31. Dielectrophoretically located CNTs were also reported for facilitating the post‐dielectrophoretic (DEP) deposition of metals from an aqueous Pd salt solution to decrease the local resistance at the CNT‐CNT and CNT‐microelectrode joints 32.…”
Section: Introductionmentioning
confidence: 99%
“…Although the potential of dielectrophoresis to separate, characterise and purify the target cells has been proven in different works 33–36, the developed system can improve the functional range of DEP systems to trap and analyse the cells with low conductivity and permittivity 37. Furthermore, in contrast to most DEP systems that are droplet‐based and employ a droplet of CNT suspension for patterning, characterising or separating purposes 11, 16, 30, 32, 38, the developed DEP system is continuous flow‐based, which facilitates the analysing of a larger amount of the samples. With such a microfluidic system, the complex interaction between micro and nano materials in the presence of an electric field can be observed and investigated.…”
Section: Introductionmentioning
confidence: 99%
“…Figure 3 a shows the representative I-V characteristic of RGOS-based electrical circuits. The characteristic is linear and symmetric [ 16 ]. The measured resistance is calculated about 12.3 k Ω.…”
Section: Methodsmentioning
confidence: 99%
“…It also means the resistance of a CNT-CNT junction when an overlapped joint takes place between two CNTs. The two cases are demonstrated in Fig.1, in which the CNT-CNT contact is shown in the middle dashed box b, and the CNT-metal contacts are shown in the other two boxes a and c, as explained by Ranjan and Mertig [17]. The contact resistance plays a key role in the application of CNTs in nanoelectronics.…”
Section: Introductionmentioning
confidence: 95%
“…After the metal deposition, the whole resistance including the conductive resistance of MWNTs and contact resistance was on the order of 100 Ω. Vilà et al [64] obtained metallic contacts to access different nanometer-sized materials using a dual-beam FIB instrument which was equipped with a C9H16Pt injector to deposit Pt. Ranjan and Merrtig [17] reported the improvement of contact resistance of CNTs by the deposition of metal from an aqueous Pd salt solution. The overall resistance was below 1 MΩ in their experiments.…”
Section: Metal Depositionmentioning
confidence: 99%