Dielectric thermally conductive boron nitride/polyimide composites with outstanding thermal stabilities via in -situ polymerization-electrospinning-hot press method

Gu, Junwei; Lv, Zhaoyuan; Wu, Yalan; Guo, Yue; Tian, Lidong; Qiu, Hua; Li, Wanzheng; Zhang, Qiuyu

doi:10.1016/j.compositesa.2016.12.014

Cited by 359 publications

(139 citation statements)

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“…Despite the higher residue for PP‐10 at 500°C, the difference of the degradation behavior between PP‐5 and PP‐10 are insignificant, indicating that the formation of 3D conductive pathways is crucial for the enhancement of thermal stability for CNT‐containing polymer composites. The heat‐resistance index (HRI) which was employed as an indicator to reflect the thermal stability has been calculated as per Gu et al Table shows that the values of HRI for the middle region of PP/CNT microparts increase with increasing loading concentration of CNT, suggesting that the thermal stability of PP/CNT composites increases with increasing filler content. Please also note that there is only marginal increase of HRI when the concentration of CNT was increased from 5 to 10 wt%, confirming that the construction of CNT network contributes to the enhancement of thermal stability and further increasing filler content only has a minor effect on the enhancement of thermal stability.…”

Section: Resultsmentioning

confidence: 99%

Electrical, thermal, and mechanical properties of polypropylene/multiwalled carbon nanotube micromoldings

2019

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In this paper, properties of microparts molded from polypropylene/multiwalled carbon nanotubes (PP/CNT) composites were studied in detail. Results indicated that the percolation threshold of PP/CNT microparts shifted to higher filler concentrations when compared with their compression molded counterparts. Morphology observations revealed that the distribution of CNT is not uniform along the flow direction, which can significantly affect the properties of microparts. The thermal properties of PP and PP/CNT composites as well as corresponding microparts were investigated using differential scanning calorimetry and thermogravimetric analysis, respectively. Moreover, the mechanical properties of microparts were evaluated by nanoindentation analysis. Multicycling measurements indicated that the mechanical properties of microparts are both depth and location dependent. Both the hardness and elastic modulus increased with corresponding filler loading concentration of CNT below 3 and 7 wt%, respectively. Above those concentrations, both properties decreased with an increase of CNT concentration. This could be related to the state of filler distribution within the microparts.

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Section: Resultsmentioning

confidence: 99%

Electrical, thermal, and mechanical properties of polypropylene/multiwalled carbon nanotube micromoldings

2019

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“…Electrospinning technology has been shown to be an effective method for improving the dispersion and alignment of the thermally conductive fillers in the polymeric matrix [26,27,128]. In Gu's previous research [129], micrometer boron nitride/polyamide acid (mBN/PAA) electrospun fibers was firstly fabricated via in situ polymerizationelectrospinning technology, then performed to fabricate the thermally conductive mBN/polyimide (mBN/PI) composites. The addition of 30 wt% mBN could improve the λ value of the original PS from 0.174 to 0.696 W/mK.…”

Section: Other Methodsmentioning

confidence: 99%

A review on thermally conductive polymeric composites: classification, measurement, model and equations, mechanism and fabrication methods

Yang

Liang

et al. 2018

Adv Compos Hybrid Mater

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294

124

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With the fast-developing miniaturization and integration of microelectronics packaging materials, ultrahigh-voltage electrical devices, light-emitting diodes (LEDs), and in areas which require good heat dissipation and low thermal expansion, the investigations on the polymeric composites with highly thermal conductivities and excellent thermal stabilities are urgently required, which would be beneficial to transferring the heat to the outside of the products, finally to effectively avoid substantial overheating and prolong their working life. Our article reviews recent progress in the classification, measurement methods, model and equations, mechanisms, commonly used thermally conductive fillers, and the correlative fabrication methods for the thermally conductive polymeric composites, aiming to understand and grasp how to enhance the λ value effectively. And future perspectives, focusing scientific problems and technical difficulties of the present thermally conductive polymeric composites are also described and evaluated.

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“…SEM (Hitachi S‐4800, Japan) was performed to investigate the mechanical and interfacial properties of aramid–mica composites at 3.0 kV . According to GB/T 453‐1989, the mechanical property of tensile strength was analyzed with a 062/969921 computer‐controlled paper testing equipment paper tensile strength tester, the size of the test strips being 1.5 cm × 25 cm.…”

Section: Methodsmentioning

confidence: 99%

A novel mica‐based composite with hybrid aramid fibers for electrical insulating applications: largely improved mechanical properties and moisture resistance

Zhao

Dang

et al. 2017

Polymer International

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The fabrication of mica‐based composites with good mechanical properties is very important especially for electrical insulation applications. In this study, a new aramid fibrid along with chopped fibers was introduced into a mica system, and the composites were prepared using a papermaking machine. It was found that the mechanical properties of both fibrid–mica composite (F‐M paper) and fiber/fibrid–mica composite (A‐M paper) were largely improved in comparison with the reference sample (M paper) with an increase in the content of fibrid or hybrid floc/fibrid. This enhancement can be attributed to two mechanisms: (1) enhanced interfacial adhesion derived from the addition of fibrids with good flexibility and wrapping properties and (2) significant reinforcing due to the frameworks originating from the addition of chopped flocs with high modulus and rigid‐rod morphology. Interestingly, a synergetic effect of enhanced interfacial adhesion and reinforcing could also be observed when both flocs and fibrids were introduced, which further improved the mechanical properties. Furthermore, the addition of aramid fibrid greatly enhanced the moisture resistance, which expands the potential for mica‐based composites. Thus, we successfully fabricated a mica‐based composite for electrical insulation with good mechanical properties, high end‐use temperature and excellent moisture resistance by adding hybrid aramid fibers. © 2017 Society of Chemical Industry

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Dielectric thermally conductive boron nitride/polyimide composites with outstanding thermal stabilities via in -situ polymerization-electrospinning-hot press method

Cited by 359 publications

References 50 publications

Electrical, thermal, and mechanical properties of polypropylene/multiwalled carbon nanotube micromoldings

Electrical, thermal, and mechanical properties of polypropylene/multiwalled carbon nanotube micromoldings

A review on thermally conductive polymeric composites: classification, measurement, model and equations, mechanism and fabrication methods

A novel mica‐based composite with hybrid aramid fibers for electrical insulating applications: largely improved mechanical properties and moisture resistance

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