Dielectric surface roughness scattering induced crosstalk performance of coupled MCB interconnects

Sharma, Manvi; Kumar, Mayank; Khanna, Rajesh

doi:10.1016/j.mejo.2021.105084

Cited by 9 publications

(2 citation statements)

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“…F I G U R E 4 Equivalent single conductor model of a mixed carbon nanotube bundle (MCB) interconnect. 23 substrate where MFP depends upon the scattering of electrons due to acoustic phonon, and nonpolar emission and absorption of optical phonons in CNT are mathematically given as 27…”

Section: Esc Modeling Of the Proposed Optimized Structure Of Rmcbmentioning

confidence: 99%

“…18 The fabrication of MWCNTs is easier than that of SWCNTs, 19 and researchers found that MWCNT bundles performed better than SWCNTs with random chiralities. 20 But according to researchers, it is marked that realistic CNT bundles have both SWCNTs and MWCNTs of different diameters as it is not possible to control the growth of CNTs with uniform sizes, [21][22][23] and these bundles of CNTs are referred as mixed CNT bundles (MCBs). Conductance performance of the MCBs is analyzed by authors in Haruehanroengra and Wang 24 and demonstrates that MCB provides better conductance improvement over copper.…”

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confidence: 99%

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Structure optimization: Configuring optimum performance of randomly distributed mixed carbon nanotube bundle interconnects

Sharma

Kumar

Khanna

2023

Circuit Theory & Apps

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SummaryThis paper presents an efficient optimization strategy based on the Stoyan and Yaskov algorithm to maximize the tube density of randomly distributed mixed carbon nanotube bundles (RMCBs) for configuring optimum performance of on‐chip interconnects. Optimizing tube density has proposed eight different RMCB (RMCB1–RMCB8) structures of a varying number of carbon nanotubes (CNTs), where RMCB1 has the maximum CNTs. Moreover, the ABCD technique adequately analyzes the temperature‐dependent frequency and stability characteristics of a three‐line RMCB interconnect placed on smooth and rough substrates (SiC, BN, and SiO2). The smooth substrate material has the best 3‐dB bandwidth compared with rough SiC substrate, followed by BN and SiO2 for all RMCB structures, and among all structures, the RMCB8 has the best 3‐dB bandwidth. The relative stability of RMCB1 is improved by 134.2% and 22.7% w.r.t. RMCB8 placed on a smooth and rough SiC substrate, respectively. Whereas bandwidth of the RMCB1 is reduced by 26% and 88.5% w.r.t. RMCB8 placed on a smooth and rough substrate, respectively. Hence, there is a tradeoff between the bandwidth and the relative stability as the number of CNT increases. Therefore, RMCB3 placed on a smooth substrate and RMCB4 placed on a rough SiC substrate are considered the best‐optimized RMCB interconnects to maintain a balance between the two.

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Section: Esc Modeling Of the Proposed Optimized Structure Of Rmcbmentioning

confidence: 99%