Dielectric properties of the FR-4 substrates in the THz frequency range

Beziuk, Grzegorz; Jarzab, P. P.; Nowak, Kacper; Pliński, Edward F.; Walczakowski, Michał; Witkowski, Jerzy S.

doi:10.1109/irmmw-thz.2012.6380160

Cited by 6 publications

(4 citation statements)

References 4 publications

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“…PCBs are currently used as a platform for THz on chip development, [110][111][112] enabling subwavelength sensing to allow fully integrated spectroscopic chips operating across 0.04 to 0.99 THz without the need for any external THz source, drastically lowering costs for THz inspection systems. For this reason, there is extensive research into the THz radiation penetration depth and effect upon FR4, 113 the epoxy woven fiber material which comprises the substrate of a PCB. PCBs can often be used as motherboards for desktops or logic boards for smartphones and the understandings of how THz signals propagate through or near a PCB are critical.…”

Section: Pcb and Thz Radiation Interactionmentioning

confidence: 99%

Review of THz-based semiconductor assurance

True

Jessurun

et al. 2021

Opt. Eng.

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Terahertz radiation for inspection and fault detection has been of interest for the semiconductor industry since the first generation and detection of THz signals. Until recent hardware advances, THz systems lacked the signal quality and reliability for use as an effective nondestructive testing (NDT) method. Incremental advances in THz sources, detectors, and signal processing resulted in the successful applied-industrial use of THz NDT techniques on carbon fiber laminates, automotive coatings, and for detection of counterfeit pharmaceutical tablets. Semiconductor inspection and verification methods ensure the functionality and thereby safety of vital electronics for several critical industries. For this reason, the reliability and verification of a THz NDT method must exceed currently used inspection systems. With recent laboratory access to THz radiation, THz inspection methods are often compared with existing optical, electrical, and volumetric semiconductor verification techniques for their production monitoring and failure analysis viability. This review will cover THz techniques and their applications at the printed circuit board (PCB), integrated circuit (IC), and transistor/gate scales. The THz radiation gap spans between optical and electronic ranges with a millimeter-sized wavelength allowing for adequate penetration of plastic and ceramic and semiconductor materials. THz radiation can be used to determine structural features, electrical signatures in the THz range, and chemical information simultaneously. Cost and environmental limitations restricted the ability for THz NDT semiconductor inspection methods to escape the lab and succeed in the dynamic environment of a semiconductor fabrication environment. Hybridized metrology methods incorporating information from multiple inspection tools are a regime where THz spectral and structural data can be combined with existing methods such as optical, x-ray, or E-beam. THz can be used initially to offer support to the complex failure analysis and verification requirements of the semiconductor industry from nanoscale to macroscale features and components. For THz systems to become independent inspection tools used for semiconductor production monitoring, in the lab or fab, this will require a confident level of statistical process control for THz signal generation, detection, or processing. Applied industrial semiconductor device inspection will likely be a result of a combination of research into THz hardware, reconstruction techniques, and the widespread application of machine learning techniques. Many breakthroughs occurred over the years to enable successful nondestructive characterization and inspection of semiconductor devices from the nanoscale transistors to fully packaged integrated circuits and assembled PCBs.

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Section: Pcb and Thz Radiation Interactionmentioning

confidence: 99%

Review of THz-based semiconductor assurance

True

Jessurun

et al. 2021

Opt. Eng.

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“…For printed circuit boards fr-4 is the most popular and suitable substrate. It consists of glass fibers embedded in an epoxy resin [10]. The antenna radiating patches have different length and width and its radiating portion covers a T-shape, overall designed antenna covers 85x50x1.574mm including ground and the substrate.…”

Section: Antenna Design and Developmentsmentioning

confidence: 99%

Multiband Stepped Impedance Resonator (SIR) Based Antenna for Future Wireless Applications

Saeed

Rehman

et al. 2020

2020 International Conference on UK-China Emerging Technologies (UCET)

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A novel multiband stepped impedance resonator (SIR) based microstrip antenna is presented in this paper. The presented antenna is explicitly designed to overcome the multistandard requirements of future wireless communication systems. The antenna contains six radiating patches, occupies a volume of 85x50x1.574mm. The antenna contains three shortcircuited dual band SIR radiating patches. The SIR radiating patches are optimized to operate at the specified frequency bands of 0.9GHz, 1.2GHz, 1.5GHz, 2.5GHz, 2.75GHz, and 3.65 GHz. The SIR radiating patches are fed using a single coaxial feeding technique which shows a good matching of 50 Ohm. In stepped impedance technique; of three resonators one of the radiating patches is short circuited with a ground. The simulated results of reflection coefficient, impedance matching, and peak gains show stable responses and are acceptable. Antenna is designed using FR-4 as a substrate whereas; CST studio and MATLAB are utilized as simulation tool. The proposed antenna verifies to be a suitable candidate for small mobile devices and other multi-standard wireless communication devices.

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“…Therefore, the value of ε r = 4.4 and loss tangent δ = 0.02 does not hold for 1 THz. This frequency dependence can be modeled by the Debye electric model (Beziuk et al 2012).…”

Section: Design Of Terahertz Metamaterials Using Scalingmentioning

confidence: 99%

“…Here, ε r and tan δ are the dielectric constant and the loss tangent at the reference frequency respectively, ω r (Beziuk et al 2012).…”

Section: Design Of Terahertz Metamaterials Using Scalingmentioning

confidence: 99%

Active Terahertz Metamaterial for Biomedical Applications

Choudhury

Menon

Jha

2015

Active Terahertz Metamaterial for Biomedical Applications

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Terahertz (THz) spectroscopy is gaining momentum as a tool for imaging in the field of biomedical engineering. This increase in popularity is due to the non-invasive, non-ionizing nature of terahertz radiation coupled with its propagation characteristics in water, which allows the operator to obtain high-contrast images of skin cancers, burns, etc. without detrimental effects. In order to tap this huge potential, researchers worldwide are aiming to build highly efficient biomedical imaging systems by introducing terahertz absorbers into biomedical detectors. The biggest challenge faced in the fulfilment of this objective is the lack of naturally occurring dielectrics, which is overcome with the use of artificially engineered resonant materials, viz. the metamaterials. This book describes such a metamaterial-based active absorber. The design has been optimized using particle swarm optimization (PSO), eventually resulting in an ultra-thin active terahertz absorber. The absorber shows near unity absorption for a tuning range of terahertz (THz) application.

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Dielectric properties of the FR-4 substrates in the THz frequency range

Cited by 6 publications

References 4 publications

Review of THz-based semiconductor assurance

Review of THz-based semiconductor assurance

Multiband Stepped Impedance Resonator (SIR) Based Antenna for Future Wireless Applications

Active Terahertz Metamaterial for Biomedical Applications

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