Dielectric properties of photocrosslinkable polyimide/functional graphene oxide composites

Chen, Zhigeng; Zhao, Jianqing; Shi, Yan; Yuan, Yan; Liu, Shumei

doi:10.1016/j.matlet.2015.05.104

Cited by 23 publications

(12 citation statements)

References 14 publications

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“…Polyimides (PIs) are high performance polymers with excellent thermal stability and superior mechanical strength [6]. However, the low dielectric constant (2.5~3.5) of PIs greatly limits their applications in modern electronics [7,8]. Recently, PI composites with improved dielectric properties and good mechanical properties were successfully fabricated by incorporating inorganic fillers, such as BaTiO 3 nanoparticles [9], multi-walled carbon nanotubes (MWCNTs) [10], Zirconia nanocrystals [11], hybrid BaTiO 3 /MWCNTs [12], and so on.…”

Section: Introductionmentioning

confidence: 99%

Electrospun nanofiber reinforced all-organic PVDF/PI tough composites and their dielectric permittivity

et al. 2015

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Section: Introductionmentioning

confidence: 99%

Electrospun nanofiber reinforced all-organic PVDF/PI tough composites and their dielectric permittivity

et al. 2015

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“…In addition, the XRD pattern of FCGO displays another diffraction peak at ca. 24.7° assigned to the graphitic (002) face . The XRD patterns suggest that GO is partially reduced to graphene during the preparation of FCGO.…”

Section: Results and Discussionmentioning

confidence: 99%

New Synthetic Approach of Fluorine-Containing Graphene Oxide for Improving Dielectric and Mechanical Properties of Polyimide Composites

Chen

Huang

Shi

et al. 2017

Ind. Eng. Chem. Res.

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A new approach to synthesize fluorine-containing graphene oxide (FCGO) was proposed, in which a less toxic reagent was used rather than fluorine gas or anhydrous hydrogen fluoride. The dielectric and mechanical properties of polyimide composites were improved by incorporating a small amount of FCGO. FCGO served as not only nanofiller to lower the dielectric constant of PI films but also inorganic toughening particles to improve the toughness of PI films. The dielectric constant of PI films with 0.6 wt % FCGO was decreased from 3.33 for pure PI to 2.34. In addition, both the tensile strength and Young's modulus of PI films with 0.6 wt % FCGO were increased to 141 MPa and 4.95 GPa from 118 MPa and 2.81 GPa for pure PI, respectively. In addition, its tensile energy to break was enhanced to 31.6 MJ/m 3 from 20.8 MJ/m 3 .

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“…The ε of SiCN ceramics can reach up to 2 × 10 4 , which resulted from their unique biphasic microstructure . In this study, SiCN ceramics were used as a functional filler, while polyimide (PI) served as the polymer matrix owing to its excellent thermal stability, low dielectric loss (tan δ), and good mechanical properties . The SiCN/PI composite with 25 vol% SiCN showed a ε as high as 190 at 0.1 Hz.…”

Section: Introductionmentioning

confidence: 99%

“…There are two types of high‐ε composites, depending on the improvement methodology used. The first one lies in incorporating conductive fillers such as silver particles, carbon nanotubes and graphene to the polymer matrix . The resulting composites show very high ε with low filler contents based on the percolation theory.…”

Section: Introductionmentioning

confidence: 99%

Low‐frequency dielectric performance of polyimide composites containing amorphous polymer‐derived SiCN ceramics

et al. 2019

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High-dielectric-constant polymer-matrix composites have potential applications as embedded capacitors. In this paper, an amorphous polymer-derived SiCN ceramic was incorporated into a polyimide (PI) matrix by in situ polymerization for the first time. The resulting SiCN/PI composite showed good thermal stability below 500 C, with the SiCN filler being homogeneously dispersed in the PI matrix. The dielectric properties of the SiCN/PI composites were investigated over a broad frequency range (0.1-10 6 Hz). The dielectric properties of the SiCN/PI composites at low frequencies revealed a weak percolation phenomenon similar to that shown by conductive/polymer composites and the calculated percolation threshold was 22.8 vol%. At SiCN loadings of 25 vol%, the SiCN/PI composites showed a high dielectric constant of 190 at 0.1 Hz, which is 57 times higher than that of pure PI (3.3). The conductivity of the 25 vol% SiCN/PI composite was as low as 8.5 × 10 −10 SÁcm −1 . These results could be explained by the unique microstructure of the polymer-derived SiCN ceramic, containing an amorphous Si matrix and a free carbon phase. This study revealed SiCN/PI composites as promising dielectric materials with promising applications in energy storage fields.

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Dielectric properties of photocrosslinkable polyimide/functional graphene oxide composites

Cited by 23 publications

References 14 publications

Electrospun nanofiber reinforced all-organic PVDF/PI tough composites and their dielectric permittivity

Electrospun nanofiber reinforced all-organic PVDF/PI tough composites and their dielectric permittivity

New Synthetic Approach of Fluorine-Containing Graphene Oxide for Improving Dielectric and Mechanical Properties of Polyimide Composites

Low‐frequency dielectric performance of polyimide composites containing amorphous polymer‐derived SiCN ceramics

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