Dielectric properties and thermal conductivity of micro-BN-modified LSR used for high-voltage direct current cable accessories

Chen, Qingguo; Xi, Banggen; Zhang, Jinfeng; Yang, Hongda; Wang, Xinyu; Chi, Minghe

doi:10.1007/s10854-020-04213-w

Cited by 6 publications

(4 citation statements)

References 8 publications

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“…Polymer composites are widely used in aerospace, automotive, construction, electronic components, and other fields due to their excellent mechanical properties and corrosion resistance. , However, low thermal conductivity limits their applications; they must be modified to obtain high thermal conductivity. Therefore, the preparation of high thermal conductivity polymer composites has become an urgent problem. , Generally speaking, polymers are mixed with thermally conductive fillers to improve the thermal conductivity of polymer materials, , such as metal filler (Ag, − Cu, − Au), ceramic filler (MgO, , Al 2 O 3 , − BN, − AlN, , SiC, ,, SiO 2 − ), and carbon material (carbon fiber, ,, carbon black, − graphene, , single-wall/multi-wall, − and graphite ,− ). However, ceramic fillers and metal fillers generally have high density, and it is difficult to achieve high thermal conductivity with low filler content.…”

Section: Introductionmentioning

confidence: 99%

Carbon Fiber/Phenolic Composites with High Thermal Conductivity Reinforced by a Three-Dimensional Carbon Fiber Felt Network Structure

et al. 2022

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The formation of highly thermally conductive composites with a three-dimensional (3D) oriented structure has become an important means to solve the heat dissipation problem of electronic components. In this paper, a carbon fiber (CF) felt with a 3D network structure was constructed through the airflow netting forming technology and needle punching. The carbon fiber/phenolic composites were then fabricated by CF felt and phenolic resin through vacuum impregnation and compression molding. The effects of CF felt content and porosity on the thermal conductivity of carbon fiber/phenolic composites were investigated. The enhancement of carbon skeleton content promotes the conduction of heat inside the composites, and the decrease of porosity also significantly improves the thermal conductivity of the composites. The results indicate that the composites exhibit a maximum in-plane thermal conductivity of 1.3 W/mK, which is about 650% that of pure phenolic resin, showing that the construction of 3D thermal network structure is conducive to the reinforcement of thermal conductivity of composites. The method can provide a certain theoretical basis for constructing a thermally conductive composite with a three-dimensional structure.

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Section: Introductionmentioning

confidence: 99%

Carbon Fiber/Phenolic Composites with High Thermal Conductivity Reinforced by a Three-Dimensional Carbon Fiber Felt Network Structure

et al. 2022

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“…Its safety and reliability are essential for the stable development of the economy. [1][2][3][4][5][6] With the development of science and technology and the progress of manufacturing technology, high-voltage motors are increasingly developing toward large capacity. How to increase the capacity of motors is a bottleneck problem that needs to be solved urgently in the motor industry.…”

Section: Introductionmentioning

confidence: 99%

Enhanced thermal conductivity and insulation properties of mica tape with BN coating via electrostatic spraying technology

Feng

Yang

et al. 2022

J of Applied Polymer Sci

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The bottleneck problem of the development of high‐voltage motors to a larger capacity can be solved if the thermal conductivity is improved without sacrificing the insulation characteristics of the main insulation material. In this paper, a spraying technology based on electrospinning is proposed that can evenly spray boron nitride (BN) with high thermal conductivity onto the surface of mica tape. With the increase in BN content, the insulation and thermal conductivity of mica tape are optimized to varying degrees. When the BN content reaches 2.25 wt%, the in‐plane conductivity increases from 1.6 to 2.7 w/(m K), while the out‐of‐plane conductivity increases from 0.17 to 0.26 w/(m K). Additionally, the direct‐current (DC) breakdown strength has increased from 90.6 to 96.9 kV/mm and the dielectric constant and dielectric loss are almost unchanged. Finally, through simulation verification, if the modified mica tape is applied to the main insulation of a synchronous motor, the operating temperature of the motor insulation will be reduced from 73.5 to 66.1°C. This study provides a new research idea for the preparation of high thermal conductivity insulating materials.

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“…Therefore, it is imperative to develop an effective strategy to enhance the mechanical properties and erosion resistance of ALSR. To overcome these problems, an effective method is to disperse nanoparticles into the ALSR, such as clay [15], TiO 2 [16][17][18][19], SiO 2 [20][21][22][23], graphene [24][25][26][27], carbon nanotubes [28,29], boron nitride (BN) [30,31], and aluminum nitride (AlN) [32]. However, due to the high permittivities and poor compatibility of these materials with ALSR, the dielectric constant of the ALSR signi cantly increases [33].…”

Section: Introductionmentioning

confidence: 99%

Efficiently Enhancing Low-dielectric Properties and Chemical Resistances of Addition-cure Liquid Silicone Rubber by Filling With Silicone-modified Eucommia Gum Nanofiller

Sheng-pei

Wang

et al. 2021

Preprint

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It is of great interest and remains a challenge to simultaneously improve the low-dielectric properties and chemical resistances of addition-cure liquid silicone rubber (ALSR). In this work, we proposed an efficient approach to address this issue by filling silicone-modified eucommia gum nanofiller (SEUG) into ALSR. By adding 5 wt% SEUG, the dielectric constant of the SEUG/ALSR composite rubber was significantly lower than that of neat ALSR both at 102 Hz, 103 Hz and 104 Hz. Simultaneously, the SEUG/ALSR composite rubber exhibited better mechanical and insulation properties than the neat ALSR after HCl, NaCl, and oil resistance tests. Our findings demonstrated the great potential for fabricating silicone rubber with low-dielectric properties and erosion resistance by the utilization natural biomass rubber material, endowing it with excellent mechanical performance and degradability.

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Dielectric properties and thermal conductivity of micro-BN-modified LSR used for high-voltage direct current cable accessories

Cited by 6 publications

References 8 publications

Carbon Fiber/Phenolic Composites with High Thermal Conductivity Reinforced by a Three-Dimensional Carbon Fiber Felt Network Structure

Carbon Fiber/Phenolic Composites with High Thermal Conductivity Reinforced by a Three-Dimensional Carbon Fiber Felt Network Structure

Enhanced thermal conductivity and insulation properties of mica tape with BN coating via electrostatic spraying technology

Efficiently Enhancing Low-dielectric Properties and Chemical Resistances of Addition-cure Liquid Silicone Rubber by Filling With Silicone-modified Eucommia Gum Nanofiller

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