MELECON '98. 9th Mediterranean Electrotechnical Conference. Proceedings (Cat. No.98CH36056)
DOI: 10.1109/melcon.1998.692348
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Dielectric constant measurements using printed circuit techniques at microwave frequencies

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Cited by 7 publications
(4 citation statements)
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“…A number of methods [1][2][3][4][5][6][7][8][9][10][11][12][13][14][15][16] are available for measuring the dielectric constant of a slab/sheet/laminate substrate material at microwave frequencies. These may be classified as either nondestructive or destructive methods.…”
Section: Previous Workmentioning
confidence: 99%
See 1 more Smart Citation
“…A number of methods [1][2][3][4][5][6][7][8][9][10][11][12][13][14][15][16] are available for measuring the dielectric constant of a slab/sheet/laminate substrate material at microwave frequencies. These may be classified as either nondestructive or destructive methods.…”
Section: Previous Workmentioning
confidence: 99%
“…Slawomir and Zaradny [12] have measured dielectric constant of a microwave laminate using symmetricstrip-transmission line technique with accuracy less than 3%. Yehuda Kantor [13] has presented three methods-microstrip resonator, stripline resonator and closed disk resonator to determine dielectric constant of laminates having thickness of 0.2 -3mm with dielectric constant varying from 2 to 20. Du Shimin [14] has presented a method of measuring dielectric constant of a thin slab material using resonance frequency of a microstrip patch antenna.…”
Section: Previous Workmentioning
confidence: 99%
“…For example, test procedures utilizing a lumped element are limited to the frequency range below 1 GHz [1] while those based on microwave cavities, or microstrip resonators require rather large samples [2][3][4]. In the resonant techniques, the radiation losses and non-optimized coupling conditions are common sources of errors in the measured permittivity.…”
Section: Introductionmentioning
confidence: 99%
“…Furthermore, challenges arise in the measurement of thin materials (1-3 mm) employed in the packaging technology, where uncertainties in the material thickness would result in uncertainties in the permittivity that can be extracted. In particular, the need for a real-time extraction of the complex permittivity of thin packaging substrates over broadband remains a practical concern faced by the microelectronics industry, which has been little addressed by available literature [1][2][3].…”
Section: Introductionmentioning
confidence: 99%